Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Yıl 2018, Cilt: 31 Sayı: 4, 1229 - 1244, 01.12.2018

Burcu Cıcek Necmettin Sahın Mahmut Alkan

Öz

In this study, in order to provide heat
dissipation of the high power LEDs to be used for street illumination, U-shaped
cylindrical copper heat pipes are used. Thermal analysis of this system was
carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis
was performed for different numbers, diameters and lengths of heat pipes and
optimum values were obtained. Afterwards, the optimum materials to be used as
components of LED packages were determined. In addition, the effect of the
power applied to the LED chip and of ambient temperature on the temperature
distribution of the whole system was examined.

Anahtar Kelimeler

High Power LED's, CFD, Heat Pipe, Thermal analysis

Kaynakça

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