Year 2019, Volume 6, Issue 1, Pages 1 - 7 2019-01-31

Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate
İndiyumun Sn-2Ag-0,5Cu-1In Dörtlü Lehim Alaşımı'nın Cu Altlık Üzerine Islatılabilirliği Üzerine Etkisi

Okan UYANIK [1] , Ahmet Mustafa ERER [2] , Yunus TÜREN [3]

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Bu çalışmanın amacı, ergitilmiş Sn-2Ag-0.5Cu-1In kurşunsuz lehim alaşımının argon atmosferinde Cu altlık üzerinde önceden belirlenmiş sıcaklıklarda (250, 280 ve 310 °C) ıslatma özelliklerini incelemektir. Alaşımın temas açısı (θ) sessile damla tekniği kullanılarak ölçülmüştür. Yapılarda (IMC) yer alan intermetalik fazlar, mikro yapılar ve alaşımların ergime sıcaklıkları sırasıyla taramalı elektron mikroskobu (SEM + EDX), X-ışını difraksiyonu (XRD) ve diferansiyel taramalı kalorimetre (DSC) ile incelenmiştir. SAC-In / Cu ara yüzeyinde intermetalik bileşikler gözlenmiştir. Islatma testlerinin sonuçları, % 1 oranında In ilavesinin, Sn-3Ag-0.5Cu lehim alaşımının ıslatma özelliklerini belirli bir miktar geliştirdiğini göstermektedir. En düşük açı değeri 310 °C' de 35.55 ° olarak elde edildi. Pb'siz lehim alaşımları ve Cu altlık arasındaki intermetalik bileşiklerin (IMC) oluşumu gözlendi. Sonuç olarak, çalışmalar Sn–2Ag-0.5Cu-1In dörtlü alaşımının ıslatma özelliklerinin Sn–3Ag-0.5Cu üçlü alaşımından daha iyi olduğunu göstermektedir.

This study reports the investigation on indium addition into Sn–3Ag-0.5Cu ternary lead-free solder to improve its various performances. The effects of indium addition on wettability of the solder alloy was studied. The results showed that when the addition of indium was 1 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In solder was negligible, but the contact angles (θ) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The lowest θ was obtained as 35,55°for Sn–2Ag-0.5Cu–1In  alloy at 310 °C. The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed. As a result, the studies show that the wetting capability of Sn–2Ag-0.5Cu–1In quaternary alloy is better than Sn–3Ag-0.5Cu ternary alloy.

  • ISLAC18 (Karabük)'den seçilmiş makale.
Primary Language en
Subjects Engineering
Journal Section Makaleler
Authors

Author: Okan UYANIK (Primary Author)
Institution: KARABÜK ÜNİVERSİTESİ, FEN FAKÜLTESİ
Country: Turkey


Author: Ahmet Mustafa ERER
Institution: KARABÜK ÜNİVERSİTESİ, FEN FAKÜLTESİ
Country: Turkey


Author: Yunus TÜREN
Institution: KARABÜK ÜNİVERSİTESİ, MÜHENDİSLİK FAKÜLTESİ
Country: Turkey


Bibtex @research article { ecjse441434, journal = {El-Cezeri Journal of Science and Engineering}, issn = {2148-3736}, eissn = {2148-3736}, address = {Prof.Dr. Selami ŞAŞMAZ}, year = {2019}, volume = {6}, pages = {1 - 7}, doi = {10.31202/ecjse.441434}, title = {Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate}, key = {cite}, author = {UYANIK, Okan and ERER, Ahmet Mustafa and TÜREN, Yunus} }
APA UYANIK, O , ERER, A , TÜREN, Y . (2019). Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate. El-Cezeri Journal of Science and Engineering, 6 (1), 1-7. DOI: 10.31202/ecjse.441434
MLA UYANIK, O , ERER, A , TÜREN, Y . "Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate". El-Cezeri Journal of Science and Engineering 6 (2019): 1-7 <http://dergipark.org.tr/ecjse/issue/43039/441434>
Chicago UYANIK, O , ERER, A , TÜREN, Y . "Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate". El-Cezeri Journal of Science and Engineering 6 (2019): 1-7
RIS TY - JOUR T1 - Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate AU - Okan UYANIK , Ahmet Mustafa ERER , Yunus TÜREN Y1 - 2019 PY - 2019 N1 - doi: 10.31202/ecjse.441434 DO - 10.31202/ecjse.441434 T2 - El-Cezeri Journal of Science and Engineering JF - Journal JO - JOR SP - 1 EP - 7 VL - 6 IS - 1 SN - 2148-3736-2148-3736 M3 - doi: 10.31202/ecjse.441434 UR - https://doi.org/10.31202/ecjse.441434 Y2 - 2018 ER -
EndNote %0 El-Cezeri Journal of Science and Engineering Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate %A Okan UYANIK , Ahmet Mustafa ERER , Yunus TÜREN %T Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate %D 2019 %J El-Cezeri Journal of Science and Engineering %P 2148-3736-2148-3736 %V 6 %N 1 %R doi: 10.31202/ecjse.441434 %U 10.31202/ecjse.441434
ISNAD UYANIK, Okan , ERER, Ahmet Mustafa , TÜREN, Yunus . "Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate". El-Cezeri Journal of Science and Engineering 6 / 1 (January 2019): 1-7. https://doi.org/10.31202/ecjse.441434