TY  - JOUR
T1  - Numerical and Statistical Analysis of the Influence of Damage and Temperature on EMI for Structural Health Monitoring
AU  - Abdallah, Bouzitouna
AU  - Mohamed, Djemana
PY  - 2023
DA  - December
DO  - 10.55549/epstem.1412516
JF  - The Eurasia Proceedings of Science Technology Engineering and Mathematics
JO  - EPSTEM
PB  - ISRES Publishing
WT  - DergiPark
SN  - 2602-3199
SP  - 723
EP  - 732
VL  - 26
LA  - en
AB  - Structural health monitoring (SHM) is a process of implementing a system to monitor the structural condition of a structure and assess the structural health. SHM is used to detect damage, predict future performance, and monitor the overall structural health of a structure. Electromechanical impedance (EMI)-based SHM is a non-destructive evaluation (NDE) technique that can be used to detect damage in structures by measuring the changes in the electrical impedance of a piezoelectric transducer that is bonded to the structure. EMI has several advantages over other NDE techniques, including being a passive, local, and relatively inexpensive technique. However, one of the challenges of using EMI for structural health monitoring (SHM) is the effect of damage and temperature on the impedance of the piezoelectric transducer. As the damage and temperature changes, the impedance of the transducer will also change. This can make it difficult to detect small damage if the damage and temperature co-exist on the same structure (aluminum plate). This research presents a numerical and statistical study to investigate the effects of damage and temperature on EMI-based SHM. The numerical model uses ANSYS software to simulate an aluminum plate at different temperatures. The findings have shown that both damage and temperature have a significant effect on the impedance of the transducer. However, the study has also demonstrated that it is still possible to detect structural damage using EMI even under varying damage and temperature conditions. This underscores the robustness of EMI-based damage detection methodologies in practical applications.
KW  - Statistical analysis
KW  - Finite element modeling
KW  - Structural health monitoring (SHM)
KW  - Damage detection
KW  - Electromechanical impedance (EMI)
CR  - Chen, C., Huang, S., & Wu, F. (2019). Temperature compensation for electromechanical impedance-based damage detection of aluminum plates with cracks using a modified whale optimization algorithm. Journal of Intelligent Manufacturing, 30(8), 2993-3005.
CR  - Djemana, M., & Hrairi, M. (2016). Modelling and simulation of impedance-ased damage monitoring of structures. International Journal of Simulation Model, 15(3), 395-408.
CR  - Hu, K., Lin, X., Chen, H., & Liu, Y. (2022). Temperature effect on electromechanical impedance-based damage detection of aluminum plates with cracks. Mechanical Systems and Signal Processing, 173.
UR  - https://doi.org/10.55549/epstem.1412516
L1  - https://dergipark.org.tr/en/download/article-file/3631087
ER  -