@article{article_405136, title={NON-ISOTHERMAL FLOW MODELS WITH MASS DIFFUSION FOR A STATIONARY POROUS MEDIA BY EMPLOYING REPRESENTATIVE ELEMENTARY VOLUME}, journal={Journal of Science and Technology of Dumlupınar University}, pages={49–58}, year={2010}, author={Alakuş, Bayram}, keywords={Non-isothermal Porous media flow,Mathematical modelling,Representative Elementary Volume (REV)}, abstract={<p class="MsoNormal" style="text-align:justify;mso-pagination:none;mso-layout-grid-align: none;text-autospace:none"> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">Nowadays, in many industrial applications, porous materials play an important </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">role in the design and development processes. For instance, in alloy solidification, between </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">the solid and the fluid phases there is a region called mushy zone which contains both fluid </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">and solid. Its structure is very complicated but can be handled as an anisotropic porous </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">medium with directional variation in permeability. Other industrial applications such as </span> <span lang="EN-US">fl </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">ow over heat exchanger matrices, flow through turbo-machines, primary and secondary oil </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">recoveries etc. can very well be approximated as porous media. </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">Finally, it seems appropriate to mention that cooling of electronic micro systems is </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">becoming more and more important as much of our modern day equipment contains more </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">and more electronic circuits. In order to increase their performance and life, it is essential </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">to have proper cooling arrangement. A reliable flow and heat transfer prediction in these </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">arrangements is always difficult due to the complexity of flow structure. However, a porous </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">medium approximation to such problems can be efficient. The generalized procedure </span> <span lang="EN-US"> </span> <span lang="EN-US" style="font-size: 10pt; letter-spacing: -0.05pt;">described in this study is a good approximation for these structures. </span> <span lang="EN-US"> <o:p> </o:p> </span> </p>}, number={023}, publisher={Kütahya Dumlupinar University}