TY - JOUR T1 - Experimental realization of electromigration at high power for copper wires AU - Mahariq, İbrahim AU - Beryozkina, Svetlana PY - 2019 DA - December Y2 - 2019 DO - 10.30521/jes.616982 JF - Journal of Energy Systems JO - Journal of Energy Systems PB - Erol KURT WT - DergiPark SN - 2602-2052 SP - 158 EP - 167 VL - 3 IS - 4 LA - en AB - The electromigrationphenomenon is a topical concern in all types of interconnects in power systemsfor both low and high voltages, low and large power ranges, for instance, infabrication and manufacturing of Integrated Circuits, electronics of the powermodules, power grid interconnects etc. Due to distributed generation units, inparticular, renewable energy sources, which are commonly connected to alreadyexisting infrastructures, the considered issues related to the electromigrationimpact will result to a potential reduction of the electrical interconnectionfailure risks. Thus, the design of the integrated systems has to perform athighly efficient level with low probability of disconnections. The presentedstudy considers the effect of the electromigration in terms of the spatialdirection of the currents by observing directions of the sparks under certainarrangements of copper wires’ connections. The experimental setup has beendeveloped in order to realize and observe the theoretical expectations. Theexperimental results were conducted at around 500 A, and the correspondingobservations match theoretical expectations. KW - Electromigration KW - High power KW - Interconnect reliability KW - Physical design CR - Black, J. R. Electromigration—A brief survey and some recent results. IEEE Transactions on Electron Devices 1969, 16, 338-347. DOI: 10.1109/T-ED.1969.16754 CR - Ho, P. S. and Kwok, T. Electromigration in metals. Reports on Progress in Physics 1989, 52, 301-348. DOI: 10.1088/0034-4885/52/3/002 CR - Lienig, J, Thiele, M. Fundamentals of Electromigration-Aware Integrated Circuit Design. Fundamentals of Electromigration, Springer International Publishing, Switzerland, 2018. CR - Canumalla, S, Viswanadham, P. Portable Consumer Electronics: Packaging, Materials, and Reliability. Second level packaging–interconnect technologies, PennWell Corporation, Oklahoma, USA, 2010. CR - Celnikier, Y, Benabou, L, Dupont, L, Coquery, G. Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectronics reliability 2011, 51, 965-974. DOI: 10.1016/j.microrel.2011.01.001 CR - Poech, M. H. How materials behaviour affects power electronics reliability. In: 6th International Conference on Integrated Power Electronics Systems, 16-18 March 2010, IEEE, Nuremberg, Germany: pp. 1-6. CR - Teng, H, Zhang, H, Yang, H, Zhou, M, Tsui, A. C. Effect of moisture and temperature on Al-Cu interfacial strength. In: International Conference on Electronic Packaging Technology & High Density Packaging, 28-31 July 2008, IEEE, Shanghai, China: pp. 1-4. CR - Onuki, J, Koizumi, M, Araki, I. Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes. IEEE Transactions on components, hybrids, and manufacturing technology 1987, 10, 550-555. DOI: 10.1109/TCHMT.1987.1134799 CR - Tian, Y, Hang, C, Wang, C, Zhou, Y. Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process. In: 8th International Conference on Electronic Packaging Technology, 14-17 Aug. 2007, IEEE, Shanghai, China: pp. 1-5. CR - Bashir, M. N., Haseeb, A.S.M.A., Rahman, A.Z.M.S., et al. Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping. Journal of Materials Science 2015, 50, pp. 6748-6756. DOI: https://doi.org/10.1007/s10853-015-9230-7 CR - Smeby, J. Solder Joint Behavior in HCC/PWB Interconnections. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 1985, 8, 391-396. DOI: 10.1109/TCHMT.1985.1136512 CR - Takahashi, T, Yu, Q. Precision evaluation for thermal fatigue life of power module using coupled electrical-thermal-mechanical analysis. In: 12th Electronics Packaging Technology Conference, 8-10 Dec. 2010, IEEE, Singapore, Singapore: pp. 201-205. CR - Anzawa, T, Yu, Q, Yamagiwa, M, Shibutani, T, Shiratori, M. Power cycle fatigue reliability evaluation for power device using coupled electrical-thermal-mechanical analysis. In: 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 28-31 May 2008, IEEE, Orlando, Florida, USA: pp. 815-821. CR - Anzawa, T, Yu, Q, Shibutani, T, Shiratori, M. Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis. In: 9th Electronics Packaging Technology Conference, 10-12 Dec. 2007, IEEE, Singapore, Singapore: pp. 94-99. CR - Yang, L, Agyakwa, P. A, Johnson, and C. M. Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. IEEE Transactions on Device and Materials Reliability 2013, 13, 9-17. DOI: 10.1109/TDMR.2012.2235836 CR - Zhang, X, Selvanayagam, C. S, Yong, W. Y, Chai, T. C, Trigg, A. D. Design and development of micro-sensors for measuring localised stresses during copper wirebonding. In: 14th Electronics Packaging Technology Conference (EPTC), 5-7 Dec. 2012, IEEE, Singapore, Singapore: pp. 244-250. CR - Hamidi A, Team, P.P. Introduction to semiconductor packaging in high power electronics. Seminaire ECPE, May 2004. CR - Blaauw, D. T., Chanhee Oh, Zolotov, V, Dasgupta, A. Static electromigration analysis for on-chip signal interconnects. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2003, 22, 39-48. DOI: 10.1109/TCAD.2002.805728 CR - Trikoupis, N, Casas, J, Fontenla, A.T.P. Electromigration driven failures on miniature silver fuses at the Large Hadron Collider. In: Proceedings of Science of Topical Workshop on Electronics for Particle Physics (TWEPP-17), 11-15 Sep. 2017, Santa Cruz, California, USA: pp. 066. CR - Trouwborst, M.L, Molen, S.J, Wees, B.J. The role of Joule heating in the formation of nanogaps by electromigration. Journal of Applied Physics 2006, 99, 1-9. DOI: 10.1063/1.2203410 CR - Dwyer, V.M. Modeling the electromigration failure time distribution in short copper interconnects. Journal of Applied Physics 2008, 104, 1-12. DOI: 10.1063/1.2970171 CR - Doyen, L, Federspiel, X, Arnaud, L, Terrier, F, Wouters, Y, Girault, V. Electromigration multistress pattern technique for copper drift velocity and Black’s parameters extraction. In: International Integrated Reliability Workshop Final Report, 15-18 Oct. 2007, IEEE, S. Lake Tahoe, Canada, USA: pp. 74-78. CR - Tan C.M., He F., Electromigration Modeling at Circuit Layout Level. Springer Briefs in Applied Sciences and Technology. Springer, Singapore, 2013. CR - Gambino J., Process technology for copper interconnects. Handbook of Thin Film Deposition. Techniques, Processes, and Technologies (3rd Edition), William Andrew Publishing, Waltham, USA, 2012. CR - Chatterjee, S, Sukharev, V, Najm, F. N. Power Grid Electromigration Checking Using Physics-Based Models. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2018, 37, 1317-1330. DOI: 10.1109/TCAD.2017.2666723 CR - Jain, P, Mishra, V, Sapatnekar, S. S. Fast Stochastic Analysis of Electromigration in Power Distribution Networks. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2017, 25, 2512-2524. DOI: 10.1109/TVLSI.2017.2706520 CR - Calixto, E. Accelerated life test, reliability growth analysis, and probabilistic degradation analysis. Gas and Oil Reliability Engineering: Modeling and Analysis (2nd Edition). Gulf Professional Publishing, Texas, USA, 2016. CR - Meyer, M. A. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects, PhD, Brandenburg University of Technology Cottbus–Senftenberg, Germany, 2007. CR - Lienig, J. Interconnect and current density stress - an introduction to electromigration-aware design. In : Proceedings of the SLIP ‘05 International workshop on System level interconnect prediction, 2-3 April 2005, San Francisco, California, USA : pp. 81-88. UR - https://doi.org/10.30521/jes.616982 L1 - https://dergipark.org.tr/en/download/article-file/891285 ER -