Structural properties of Al-Si-Cu cast alloys depend on α-Al phase and intermetallics. Commercial ETIAL 180 aluminum alloy was used in this study. ETIAL 180 alloy with addition of 0.2-0.40.6% Sn and 0.4-0.6-0.7% Mg was investigated. Primary phase and intermetallics was examined in detail by analyzing SEM and mapping. It was observed that the intermetallic compounds were coarse with Sn and the variations in region of centre and edge of intermetallic phase formed due to segregation. Mg addition increased the Mg2Si phase in microstructure
Al-Si-Cu döküm alaşımlarının yapısal özellikleri α-Al fazı ve intermetaliklere bağlıdır. Bu çalışmada, özellikle otomotiv endüstrisinde yaygın olarak kullanılan ETIAL 180 alüminyum alaşımı kullanılmıştır. ETIAL 180 alüminyum alaşımına ağırlıkça % 0.2-0.4-0.6 Sn ve ağırlıkça % 0.4-0.6-0.7 Mg ilavesinin etkileri araştırılmıştır. Oluşan intermetalik yapıları incelemek üzere SEM kullanılarak EDS analizi yapılmış ve bölgesel haritalama yapılarak ilave edilen elementlerin etkileri detaylı olarak incelenmiştir. İntermetalik bileşiklerin Sn ilavesi ile kabalaştığı ve intermetalik fazda merkez ve kenar bölgesindeki değişimlerin segregasyondan dolayı oluştuğu gözlemlenmiştir. Mg ilavesinin artmasıyla ile mikro yapıdaki Mg2Sifazı artmaktadır.
THE INFLUENCE OF Sn AND Mg CONTENTS ON THE INTERMETALLIC PHASES OF ETIAL 180 ALLOY
: Structural properties of Al-Si-Cu cast alloys depend on α-Al phase and intermetallics. Commercial ETIAL 180 aluminum alloy was used in this study. ETIAL 180 alloy with addition of 0.2-0.4- 0.6% Sn and 0.4-0.6-0.7% Mg was investigated. Primary phase and intermetallics was examined in detail by analyzing SEM and mapping. It was observed that the intermetallic compounds were coarse with Sn and the variations in region of centre and edge of intermetallic phase formed due to segregation. Mg addition increased the Mg2Si phase in microstructure.
Primary Language | TR |
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Journal Section | Articles |
Authors | |
Publication Date | January 6, 2015 |
Published in Issue | Year 2013 Volume: 9 Issue: 2 |