Design and Thermal Analysis of High Power LED Light

Year 2021, Volume: 5 Issue: 1, 28 - 33, 20.03.2021

Yavuz Sümer Onur Karaman Ceren Karaman

https://doi.org/10.26701/ems.825141

Abstract

In the development of lighting technologies, light emitting diode (LED) technology plays an important role due to its high efficiency. LED lightening is the future of indoor and outdoor illumination solutions that all around of the world there is a widespread transition to save energy and have better quality illumination via LED-based solutions. On other hand, cooling of high power LED is crucial factor to utilize LED in high performance. In addition, finned heat sink could not be efficient based on the its geometry and usage areas due to the powder, the rain and the muds effects. In this study, an un-finned heat sink LED armature consisting of aluminum sheet metal was designed using a computer-aided-design (CAD) program. Furthermore, manufacturing of the heat sinks from sheet metal plates with bending machines enables to increase variety of LED armatures cheaply according to design requirements. Then, the thermal analysis of the system was conducted for the case of natural heat convection under different electrical powers and ambient temperatures by a commercial finite element analysis (FEA) program: SolidWorks Simulation. As a result of the thermal analysis, the ultimate heat sink sizes were obtained to minimize junction temperature of LED. Finally, the experimental studies were carried out to verify the feasibility of numerical solutions that they were in good agreement.

Keywords

LED, lighting, un-finned heat sink, thermal analysis, finite element analysis

References

• Zhang, J., Xu, L., Wu, X., & Qian, Z. (2011). A Precise Passive Current Balancing Method for Multioutput LED Drivers. IEEE Transactions on Power Electronics, 26(8), 2149–2159. https://doi.org/10.1109/tpel.2010.2104332
• Khan, T. Q.,Bodrogi, P., Vinh, Q. T., &Winkler, H. (Eds.). (2015). LED lighting: Technology and perception. John Wiley&Sons.
• Krames, M. R., Shchekin, O. B., Mueller-Mach, R., Mueller, G. O., Zhou, L., Harbers, G., &Craford, M. G. (2007). Status and Future of High-Power Light-Emitting Diodes for Solid-State Lighting. Journal of Display Technology, 3(2), 160–175. https://doi.org/10.1109/jdt.2007.895339
• Pimputkar, S., Speck, J. S., Den Baars, S. P., & Nakamura, S. (2009). Prospects for LED lighting. Nature Photonics, 3(4), 180–182. https://doi.org/10.1038/nphoton.2009.32
• Hui, S. Y., & Qin, Y. X. (2009). A General Photo-Electro-Thermal Theory for Light Emitting Diode (LED) Systems. IEEE Transactions on Power Electronics, 24(8), 1967–1976. https://doi.org/10.1109/tpel.2009.2018100
• Ye, H., & Zhang, G. (2011). A review of passive thermal management of LED module. Journal of Semiconductors, 32(1), 014008. https://doi.org/10.1088/1674-4926/32/1/014008
• Dong, T., & Narendran, N. (2009). Understanding heat transfer mechanisms in recessed LED luminaires. In I. T. Ferguson, C. Hoelen, J. Jiao, & T. Taguchi (Eds.), Ninth International Conference on Solid State Lighting. SPIE. https://doi.org/10.1117/12.829902
• Dong, T. (2010). An analysis of heat transfer in LED luminaires. Rensselaer Polytechnic Institute.
• Wang, R., & Li, J. (2010). A Cooling System with a Fan for Thermal Management of High-Power LEDs. Journal of Modern Physics, 01(03), 196–199. https://doi.org/10.4236/jmp.2010.13029
• Hou, F., Yang, D., & Zhang, G. (2011). Thermal analysis of LED lighting system with different fin heat sinks. Journal of Semiconductors, 32(1), 014006. https://doi.org/10.1088/1674-4926/32/1/014006
• Tang, Y., Chen, Q., Guan, W., Li, Z., Yu, B., & Yuan, W. (2017). Thermal analysis of an LED module with a novelly assembled heat pipe heat sink. Journal of Central South University, 24(4), 921–928. https://doi.org/10.1007/s11771-017-3494-9
• Moon, S. H., Park, Y. W., & Yang, H. M. (2017). A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp. Applied Thermal Engineering, 126, 1164-1169.
• Huang, D. S., Chen, T. C., Tsai, L. T., & Lin, M. T. (2019). Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights. Energy Conversion and Management, 180, 550-558.
• Hasan, M. I. (2014). Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid. Applied thermal engineering, 63(2), 598-607.
• Usman, H., Ali, H. M., Arshad, A., Ashraf, M. J., Khushnood, S., Janjua, M. M., &Kazi, S. N. (2018). An experimental study of PCM based finned and un-finned heat sinks for passive cooling of electronics. Heat and Mass Transfer, 54(12), 3587–3598. https://doi.org/10.1007/s00231-018-2389-0
• Sahbaz, M., Kentli, A., &Koten, H. (2017). Thermal analysis and optimization of high power led armature. Thermal Science, 00, 238–238. https://doi.org/10.2298/tsci170704238s
• COB D-Gen.2 Data Sheet https://cdn.samsung.com/led/file/resource/2020/07/Data_Sheet_COB_D_Series_Gen.2_Rev.2.5.pdf Accessed on 2020-10-21.
• https://www.coolermaster.com/catalog/coolers/thermal-grease/new-mastergel-pro/Accessed on 2020-10-21.