Year 2018, Volume 31, Issue 4, Pages 1229 - 1244 2018-12-01

Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Burcu CICEK [1] , Necmettin SAHIN [2] , Mahmut ALKAN [3]

74 338

In this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined.
High Power LED's, CFD, Heat Pipe, Thermal analysis
  • URL: https://www.iup.edu/energymanagement/howto/led-lighting-benefits/, 10 February (2018).
  • M. Arik, J. Prtroski, S. Weaver, Thermal challenges in the future generation solid state lighting applications: light emitting diodes, in: Proceedings of the ASME/1EEE International Packaging Technical Conference, Hawaii, (2001).
  • Y. Gu, N. Narendran, A non-contact method for determining junction tempera- ture of phosphor-convened white LEDs, Proc. SPIE 5187 (2004) 107–114.
  • J.Z. Hu, L.Q. Yang, M.W. Shin, Mechanism and thermal effect of delamination in light-emitting diode packages, Microelectron. J. 38 (2) (2007) 157–163.
  • Wang, J. C., Huang, H. S. ve Chen, S. L., 2007. Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes. International Communications in Heatand Mass Transfer, 34(8), 958-970.
  • Shen, S.C., Huang, H.J., Shaw, H.J., 2013, Design and Estimation of a MCPCB-Flat Plate Heat Pipe for LED Array Module, Proceedings of 2013 IEEE International Conference on Mechatronics and Automation August 4 - 7, Takamatsu, Japan.
  • Tang, Y., Ding, X., Li, Z., Li, B., 2014, A highpower LED device with chips directly mounted on heat pipes, Applied Thermal Engineering 66- 632-639.
  • Moon, S. H., Park, Y. W., Yang, H. M. (2016). A single unit cooling fins aluminum flat heat pipe for 100W socket type COB LED lamp. Applied Thermal Engineering.
  • Wang, M., Tao, H., Sun, Z., Zhang, C.,2017, The development and performance of the high power LED radiator. International Journal of Thermal Sciences, 113, 65-72.
Primary Language en
Subjects Engineering
Journal Section Mechanical Engineering
Authors

Orcid: 0000-0002-1777-4980
Author: Burcu CICEK (Primary Author)
Institution: Department of Mechanical Engineering, Aksaray University, 68100 Aksaray, TURKEY
Country: Turkey


Orcid: 0000-0002-5756-4216
Author: Necmettin SAHIN
Institution: Department of Mechanical Engineering, Aksaray University, 68100 Aksaray, TURKEY
Country: Turkey


Orcid: 0000-0003-3846-0689
Author: Mahmut ALKAN
Institution: Department of Mechanical Engineering, Niğde University, Niğde, TURKEY
Country: Turkey


Dates

Publication Date: December 1, 2018

Bibtex @research article { gujs411276, journal = {GAZI UNIVERSITY JOURNAL OF SCIENCE}, issn = {}, eissn = {2147-1762}, address = {Gazi University}, year = {2018}, volume = {31}, pages = {1229 - 1244}, doi = {}, title = {Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights}, key = {cite}, author = {CICEK, Burcu and SAHIN, Necmettin and ALKAN, Mahmut} }
APA CICEK, B , SAHIN, N , ALKAN, M . (2018). Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. GAZI UNIVERSITY JOURNAL OF SCIENCE, 31 (4), 1229-1244. Retrieved from http://dergipark.org.tr/gujs/issue/40684/411276
MLA CICEK, B , SAHIN, N , ALKAN, M . "Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights". GAZI UNIVERSITY JOURNAL OF SCIENCE 31 (2018): 1229-1244 <http://dergipark.org.tr/gujs/issue/40684/411276>
Chicago CICEK, B , SAHIN, N , ALKAN, M . "Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights". GAZI UNIVERSITY JOURNAL OF SCIENCE 31 (2018): 1229-1244
RIS TY - JOUR T1 - Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights AU - Burcu CICEK , Necmettin SAHIN , Mahmut ALKAN Y1 - 2018 PY - 2018 N1 - DO - T2 - GAZI UNIVERSITY JOURNAL OF SCIENCE JF - Journal JO - JOR SP - 1229 EP - 1244 VL - 31 IS - 4 SN - -2147-1762 M3 - UR - Y2 - 2018 ER -
EndNote %0 GAZI UNIVERSITY JOURNAL OF SCIENCE Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights %A Burcu CICEK , Necmettin SAHIN , Mahmut ALKAN %T Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights %D 2018 %J GAZI UNIVERSITY JOURNAL OF SCIENCE %P -2147-1762 %V 31 %N 4 %R %U
ISNAD CICEK, Burcu , SAHIN, Necmettin , ALKAN, Mahmut . "Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights". GAZI UNIVERSITY JOURNAL OF SCIENCE 31 / 4 (December 2018): 1229-1244.
AMA CICEK B , SAHIN N , ALKAN M . Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. GAZI UNIVERSITY JOURNAL OF SCIENCE. 2018; 31(4): 1229-1244.
Vancouver CICEK B , SAHIN N , ALKAN M . Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. GAZI UNIVERSITY JOURNAL OF SCIENCE. 2018; 31(4): 1244-1229.