Year 2019, Volume 32, Issue 2, Pages 572 - 580 2019-06-01

Temperature-Aware X-filling for Very Large Scale Integrated Circuits

Sivanantham SATHASIVAM [1] , Thilagavathi KARUNAMURTHY [2]

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The excess switching activity during testing increases the power dissipation beyond the normal operation of the circuit. The non-linear power distribution creates localized heating called hotspot which results in the structural damage and increased cooling package cost. The temperature of a particular block depends on heat generation and dissipation of the circuit blocks. The uniformity in power distribution among the circuit blocks is the key requirement for temperature reduction. The unspecified bits present in the test patterns are utilized to reduce the switching activity during testing. In this paper, we present an event-driven based power analysis and temperature aware X-filling to reduce the total power dissipation among the circuit blocks in such a way to reduce peak temperature. To reduce the peak temperature, the power dissipation of each block is monitored with the help of fillings the X-bits. The experiments are carried out with the ISCAS’89 benchmark circuit and show a significant reduction in peak temperature and ensure uniform power distribution during testing.

Hotspot, X-filling, Thermal-Uniformity, Test Power, Peak Temperature
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Primary Language en
Subjects Engineering
Journal Section Electrical & Electronics Engineering
Authors

Orcid: 0000-0002-1010-5178
Author: Sivanantham SATHASIVAM (Primary Author)
Institution: Vellore Institute of Technology
Country: India


Author: Thilagavathi KARUNAMURTHY
Institution: Vellore Institute of Technology
Country: India


Dates

Publication Date: June 1, 2019

Bibtex @research article { gujs430996, journal = {GAZI UNIVERSITY JOURNAL OF SCIENCE}, issn = {}, eissn = {2147-1762}, address = {Gazi University}, year = {2019}, volume = {32}, pages = {572 - 580}, doi = {}, title = {Temperature-Aware X-filling for Very Large Scale Integrated Circuits}, key = {cite}, author = {SATHASIVAM, Sivanantham and KARUNAMURTHY, Thilagavathi} }
APA SATHASIVAM, S , KARUNAMURTHY, T . (2019). Temperature-Aware X-filling for Very Large Scale Integrated Circuits. GAZI UNIVERSITY JOURNAL OF SCIENCE, 32 (2), 572-580. Retrieved from http://dergipark.org.tr/gujs/issue/45480/430996
MLA SATHASIVAM, S , KARUNAMURTHY, T . "Temperature-Aware X-filling for Very Large Scale Integrated Circuits". GAZI UNIVERSITY JOURNAL OF SCIENCE 32 (2019): 572-580 <http://dergipark.org.tr/gujs/issue/45480/430996>
Chicago SATHASIVAM, S , KARUNAMURTHY, T . "Temperature-Aware X-filling for Very Large Scale Integrated Circuits". GAZI UNIVERSITY JOURNAL OF SCIENCE 32 (2019): 572-580
RIS TY - JOUR T1 - Temperature-Aware X-filling for Very Large Scale Integrated Circuits AU - Sivanantham SATHASIVAM , Thilagavathi KARUNAMURTHY Y1 - 2019 PY - 2019 N1 - DO - T2 - GAZI UNIVERSITY JOURNAL OF SCIENCE JF - Journal JO - JOR SP - 572 EP - 580 VL - 32 IS - 2 SN - -2147-1762 M3 - UR - Y2 - 2018 ER -
EndNote %0 GAZI UNIVERSITY JOURNAL OF SCIENCE Temperature-Aware X-filling for Very Large Scale Integrated Circuits %A Sivanantham SATHASIVAM , Thilagavathi KARUNAMURTHY %T Temperature-Aware X-filling for Very Large Scale Integrated Circuits %D 2019 %J GAZI UNIVERSITY JOURNAL OF SCIENCE %P -2147-1762 %V 32 %N 2 %R %U
ISNAD SATHASIVAM, Sivanantham , KARUNAMURTHY, Thilagavathi . "Temperature-Aware X-filling for Very Large Scale Integrated Circuits". GAZI UNIVERSITY JOURNAL OF SCIENCE 32 / 2 (June 2019): 572-580.
AMA SATHASIVAM S , KARUNAMURTHY T . Temperature-Aware X-filling for Very Large Scale Integrated Circuits. GAZI UNIVERSITY JOURNAL OF SCIENCE. 2019; 32(2): 572-580.
Vancouver SATHASIVAM S , KARUNAMURTHY T . Temperature-Aware X-filling for Very Large Scale Integrated Circuits. GAZI UNIVERSITY JOURNAL OF SCIENCE. 2019; 32(2): 580-572.