TY  - JOUR
TT  - FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics
AU  - Leong, W.C.
AU  - Abdullah, M.Z.
AU  - Khor, C.Y.
AU  - Tan, H.J. TONY
PY  - 2013
DA  - March
JF  - Isı Bilimi ve Tekniği Dergisi
PB  - Türk Isı Bilimi ve Tekniği Derneği
WT  - DergiPark
SN  - 1300-3615
SP  - 43
EP  - 53
VL  - 33
IS  - 1
KW  - AKE
KW  - Esnek baskılı devre kartı
KW  - giriş/çıkış düzenlemesi
KW  - fiziksel güvenilirlik
KW  - soğutma kapasitesi
N2  - Flexible printed circuit boards (FPCB) are being used extensively in current electronics devices because of its reduced thickness and ability to bend. Physical reliability and cooling capability are the main concern in the development of FPCB electronics. Therefore, present study investigates the reliability and cooling performance of FPCB, for different air inlet/outlet arrangements, in fan sucking mode. These inlet/outlet arrangements are found to have prominent effect on the performance of FPCB. The FSI (fluid-structure interaction) study is performed using the fluid flow solver FLUENT and structural solver ABAQUS at real-time online coupled by Mesh-based Parallel Code Coupling Interface (MpCCI). In addition, the present study also explores the effect of mass flow rates on the performance of FPCB. As the flow rate increases, the cooling capability is enhanced, but deterioration is observed on the reliability
UR  - https://dergipark.org.tr/tr/pub/isibted/article/375921
L1  - https://dergipark.org.tr/tr/download/article-file/400475
ER  -