Thermal Grooving by Surface Diffusion: a Review of Classical Thermo-Kinetics Approach
Abstract
Keywords
References
- 1. Mullins WW, Shewmon PG. The kinetics of grain boundary grooving in copper. Acta Metallurgica, 7, 3 (1959) 163-170. doi: 10.1016/0001-6160(59)90069-0.
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Primary Language
English
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Journal Section
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Publication Date
June 30, 2017
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Acceptance Date
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Published in Issue
Year 2017 Volume: 4 Number: 1
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