Structural analysis of electromagnetic forces acting on the MCCB body during a short circuit using ANSYS

Year 2025, Volume: 9 Issue: 3, 169 - 176, 25.12.2025

Mehmet Onur Yağır

https://doi.org/10.35860/iarej.1760509

https://izlik.org/JA43LG67AA

Abstract

The structural integrity of circuit breakers in electrical systems is directly related to their resistance to high electromechanical forces generated during short circuits. In this study, the performance of alternative body materials for a molded case circuit breaker (MCCB) with a nominal current of 100A and a breaking capacity of 10 kA was evaluated using finite element analysis. Among the materials compared based on total deformation and von-Mises stress criteria, PPF GF (glass fiber- reinforced polypropylene) demonstrated the closest performance to BMC (9.40 mm, 604.82 MPa), with deformation values of 10.92 mm and stress values of 582.87 MPa. Among the other candidates, PA66 30GF (35% higher deformation) and PEEK/PEK (126% and 77% higher deformation, respectively) were found to be insufficient compared to BMC. Given that deformation is inevitable under short-circuit conditions, PPF GF is recommended as the most suitable alternative to BMC, thanks to its balance of mechanical strength and deformation resistance.

Keywords

Electromagnetic force effect , Circuit breaker , BMC

References

• 1. Chen, S., and W. Li, short-circuit electrodynamic analysis of low-voltage circuit breakers using multiphysics simulation, Energies, 2020. 13(22): p. 1–16.
• 2. IEC 60947-2, Low-voltage switchgear and controlgear – Part 2: Circuit-breakers, International Electrotechnical Commission, 2024. Available from: https://webstore.iec.ch (Accessed: Nov. 14, 2025).
• 3. Gupta, M., R. Singh, and A. Verma, Assessment of electrodynamic forces on LV conductors under transient fault currents, Electric Power Systems Research, 2022. 203: p. 107–116.
• 4. Li, S., and B. Zhang, Dynamic mechanical response of circuit breaker contacts during electromagnetic repulsion, IEEE Access, 2020. 8: p. 209861–209872.
• 5. Kim, Y., and D. Lee, Mechanical stress behavior of low-voltage switchgear housings subjected to high fault currents, Applied Sciences, 2023. 13(4): p. 1–12.
• 6. Al-Abbas, R., M. A. Al-Mesfer, S. A. Khan, and M. N. Baig, Transient internal pressure rise mechanisms in low-voltage assemblies under arc-fault conditions, Energies, 2022. 15(11): p. 1–18.
• 7. Lei, C., and Y. Li, Probability-based customizable modeling of thermal-magnetic circuit breakers, Energies, 2021. 14(1): p. 1–14.
• 8. Shuaa, M., H. Kara, and O. Yılmaz, Coupled electromagnetic–mechanical analysis of protection devices using ANSYS, International Advanced Research and Engineering Journal, 2023. 7(2): p. 55–62.
• 9. Mourad, H., T. Al-Hajiri, and F. Salih, Structural integrity evaluation of molded breaker enclosures using finite element methods, Materials Today: Proceedings, 2021. 45: p. 2582–2589.
• 10. Pandey, S., and A. Kumar, Digital twin approaches for electrical protection equipment in smart grids, Energies, 2022. 15: p. 1–20.
• 11. Chellim, N., M. A. Khan, L. Zhai, and Y. Wang, Applications of multiphysics modeling in circuit breaker structural and thermal design, IEEE Transactions on Industrial Electronics, 2021. 68(6): p. 5234–5245.
• 12. Yılmaz, O., Multi-domain modelling and analysis of electrical contacts using ANSYS Workbench, International Advanced Research and Engineering Journal, 2024. 8(1): p. 22–31.
• 13. Chellim, N. J., L. Zhai, and D. Sun, Applications of multiphysics simulation in circuit breaker design, IEEE Transactions on Industrial Electronics, 2021. 68.
• 14. Ünal, H., S. H. Yetgin, and A. K. Kaya, Kaya yünü mineral elyaf ve mika takviyeli poliamid-6 kompozitinin termoset polyester kompozit diske karşı aşınma davranışları, BSEU Journal of Science, 2020. 7(2): p. 802–814.
• 15. Balıkoğlu, F., S. B. Kocaman, and S. Fidan, Termoset matrisli cam elyaf takviyeli polimer (CTP) atıkların mekanik geri dönüşüm ürünlerinin sıcak pres kalıplama bileşiminde (BMC) tekrar değerlendirilmesi, Karaelmas Fen ve Mühendislik Dergisi, 2018. 8(1): p. 168–180.
• 16. Ünal, H., A. E. Akyüz, and S. H. Yetgin, Aşınma özellikleri: polimer kompozit ve çelik diske karşı cam elyaf takviyeli PEEK kompozitlerin davranışları, BSEU Journal of Science, 2022. 3: p. 431–440.
• 17. Lafranche, E., L. Cilleruelo, M. Ryckebusch, and P. Krawczak, A novel adaptive process control for injection moulding of BMC and CIC polyester compounds, Advanced Composites Letters, 2005. 14(5): p. 1–10.
• 18. Dumont, P., O. Guiraud, T. H. Le, L. Orgéas, and D. Favier, Modelling and simulation of the rheology of bulk moulding compounds (BMC) during mould filling, in 13th European Conference on Composite Materials, 2008. Stockholm.
• 19. Sheet Molding Compound, Bulk Molding Compound, Available from: https://www.idicomposites.com/smc-bmc-overview.php (Accessed: Nov. 18, 2025).
• 20. Mar-Bal Inc., Bulk Molding Compounds | Materials Engineering, Available from: https://www.mar-bal.com/capabilities-3/formulate/ (Accessed: Nov. 14, 2025).
• 21. Termoset, C. T., A. Karaman, and E. Demir, Termoset kompozitlerin incelenmesi, AKU Journal of Engineering and Applied Sciences, 2022. 5(2): p. 32–39.
• 22. Kaptan, S., and F. Kartal, A review on integration of carbon fiber and polymer matrix composites in 3D printing technology, International Advanced Research and Engineering Journal, 2024. 8(2): p. 102–115.
• 23. Spiridigliozzi, L., S. Alcantara, and A. Salvi, Valorization of bulk molding compound (BMC) waste in alkali-activated materials (AAMs) for paving applications: technical validation and life cycle assessment, Journal of Sustainable Cement-Based Materials, 2025.
• 24. Salvi, A., A. Pastorino, L. Conzatti, P. Stagnaro, A. Comite, and G. Dotelli, Pyrolysis of bulk molding compound: mechanisms, products characterization, and recovery potential, Journal of Cleaner Production, 2025. 523: p. 146376.
• 25. MDC Mould, BMC (Bulk Moulding Compound) Formula & Production, Available from: https://www.zjmdc.com/IndustryNews/BMC-bulk-moulding-compound-formula-production.html (Accessed: Nov. 14, 2025).
• 26. Cho, Y. M., H. J. Park, H. J. Lee, and K. A. Lee, Analysis of short-circuit and dielectric recovery characteristics of molded case circuit breakers according to external environment, Electronics, 2022. 11(21): p. 3575.
• 27. Salvi, A., M. Ostrowska, and G. Dotelli, Mechanical recycling of bulk molding compound: a technical and environmental assessment, in Proceedings of Andes PPS39, 2024.
• 28. Morici, E., and N. T. Dintcheva, Recycling of thermoset materials and thermoset-based composites: challenge and opportunity, Polymers, 2022. 14(19): p. 4153.
• 29. DeRosa, R., E. Telfeyan, and J. S. Mayes, Current state of recycling sheet molding compounds and related materials, Journal of Thermoplastic Composite Materials, 2005. 18(3): p. 219–240.