Numerical Investigation of Interfacial Stress Distribution in Adhesive-Bonded Joints for Different Adhesive Materials

Yıl 2022, Cilt: 14 Sayı: 2, 53 - 65, 20.12.2022

Somnath Somadder Palash Das Md Ashraful Islam Md. Abdul Hasib

https://doi.org/10.24107/ijeas.1117544

Öz

The widespread use of adhesive bonded connections has been used in a range of technical fields. In this paper, the interfacial stress distribution of adhesive bonded joint is presented. When determining whether or not a structure is dependable for use in operation, the stresses that act along the bond line of an adhesively bonded lap joint are of the utmost importance. The purpose of this study is to develop finite element solutions that are able to anticipate shear and peel stresses using the theory of elasticity as their foundation. The effect of adhesive properties on stress distribution is investigated by using different adhesive materials. By analysing five different adhesive materials it is concluded that ‘adhesive I’ is more reliable for operation.

Anahtar Kelimeler

Adhesive bonded joints, Interfacial stress, Finite element solution, Adhesive materials.

Kaynakça

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