PECVD YÖNTEMİ İLE TOHUMLARIN HİDROFOBİK İNCE FİLMLE ENKAPSÜLASYONU

Yıl 2021, Cilt: 9 , 1 - 9, 30.12.2021

Mehmet GÜRSOY

https://doi.org/10.36306/konjes.969486

Öz

Sürdürülebilir tarım için tohumların modifikasyonu ile ilgili çalışmalara duyulan ilgi her geçen gün artmaktadır. Geleneksel tohum modifikasyonlarının birçoğunda, tohumlar kimyasallarla doğrudan muamele edilmektedir. Bu yöntemlerde kullanılan kimyasallar, çevre ve insan sağlığı için tehdit oluşturabilmektedir. Alternatif olarak, tohum modifikasyonunda çevre dostu gaz fazı yöntemler de yaygın bir şekilde kullanılmaya başlamıştır. Bu çalışmada, mercimek tohumlarının yüzeyleri düşük yüzey enerjili ince film ile gaz fazında kaplanarak, tohumların çimlenmesini geciktirmek amaçlanmıştır. Bu amaçla, plazma destekli kimyasal buhar biriktirme (PECVD) yöntemi kullanılarak mercimek tohumları tek adımda poli(heksametildisiloksan) (PHMDSO) ince filmi ile enkapsüle edilmiştir. Plazma gücünün, PHMDSO ince filminin kaplama hızı üzerine etkileri incelenmiştir. En yüksek kaplama hızı 70 W plazma gücünde 27,1 nm/dk olarak bulunmuştur. Tohum çimlendirme deney sonuçlarına göre, ince film kaplaması tohumların çimlenmesini büyük ölçüde engellemiştir.

Anahtar Kelimeler

Tohum, Enkapsülasyon, İnce film, CVD, HMDSO

Destekleyen Kurum

Konya Teknik Üniversitesi BAP koordinatörlüğü

Teşekkür

Bu çalışma, Konya Teknik Üniversitesi BAP koordinatörlüğü tarafından 202016058 nolu proje ile desteklenmiştir.

Hydrophobic Thin Film Encapsulation of Seeds Using PECVD Method

Öz

The interest in studies on the modification of seeds for sustainable agriculture is increasing day by day. In many of the traditional seed modifications, the seeds are directly treated with chemicals. The chemicals used in these methods can pose a threat to the environment and human health. Alternatively, environmentally friendly gas phase methods have also started to be widely used in seed modification. In this study, it was aimed to delay the germination of lentil seeds by coating the surfaces of lentil seeds with low surface energy thin film in the gas phase. For this purpose, lentil seeds were encapsulated with poly(hexamethyldisiloxane) (PHMDSO) thin film using single-step plasma enhanced chemical vapor deposition (PECVD) method. The effects of plasma power on the deposition rate of PHMDSO thin film were investigated. The highest deposition rate was found to be 27.1 nm/min at 70 W plasma power. According to the seed germination test results, thin film coating greatly inhibited the germination of seeds.

Anahtar Kelimeler

Seed, Encapsulation, Thin film, CVD, HMDSO

Kaynakça

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