Hydrothermal analysis of archimedean spiral single and dual channel heat sink for CPU cooling

Abstract

Engineering modeling and simulation represent a predominantly design tool in the modern manufacturing industry in which the actual system is reproduced using a mathematical and scientific model. This requires CPUs with higher computational capacities. However, increas-ing the computational capacities of CPU and GPU imposes challenges in the cooling process due to space limitations. CPU liquid cooling system has attracted more interest as an efficient heat dissipation tool. This work presents computational modeling of the conjugate heat and flow for the CPU liquid heat sink cooling. An Archimedean spiral channel is grooved into the cold plate of the heat sink. Single and dual channel passes are used in this work. The out-er diameter of the cold plate is 105 mm and the channel depth is 5 mm for both single and dual-channel configurations. The conjugate heat sink model was constructed to have four different domains: CPU (alumina), glue layer (ethoxy), cold plate (copper), and liquid cool-ant (water). To incorporate the effect of turbulence, the flow rate varied to cover a range of Reynolds number from 3000 up to 15000 at a constant inlet temperature of 25 °C. The used turbulence model was the Shear Stress Transport (k-ω) to better capture the viscous, high-fre-quency flow fluctuation in the near-wall region. The bottom surface of the CPU is subjected to 450 W of heat energy. The results showed that the channel configuration and Reynolds number have a decisive impact on controlling the CPU temperature. The CPU temperature decrease as Reynolds number increases, however, the pressure drop increases at an exponen-tial rate. These findings are supported by Darcy–Weisbach equation for internal flow in which the pressure drop depends on the square of the average fluid velocity and it was noticed that the pressure drop in the dual channel was three times higher than that in the single channel. The hydrothermal performance of the Archimedean spiral channel rapidly decreased with Reynolds number and the single-channel had a slightly better performance compared with the dual-channel.

Keywords

• Heat Sink
• CPU Liquid Cooling
• Conjugate Heat Transfer
• Hydrothermal Performance
• Computational Fluid Dynamics

References

1. REFERENCES
2. [1] Zhang Z, Wang X, Yan Y. A review of the state-of-the-art in electronic cooling. E-Prime 2021;1:100009. [CrossRef]
3. [2] Yang D, Yao Q, Jia M, Wang J, Zhang L, Xu Y, et al. Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites. Energy Built Environ 2021;2:157–166. [CrossRef]
4. [3] Deng Y, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs. J Electron Pack Trans ASME 2010;132:1–6. [CrossRef]
5. [4] Chan A, Wei J. Study on Alternative Cooling Methods Beyond Next Generation Microprocessors. ASME 2003 International Electronic Packaging Technical Conference and Exhibition, InterPACK 2003. [CrossRef]
6. [5] Nada SA, El-Zoheiry RM, Elsharnoby M, Osman OS. Experimental investigation of hydrothermal characteristics of data center servers’ liquid cooling system for different flow configurations and geometric conditions. Case Stud Therm Eng 2021;27. [CrossRef]
7. [6] L.Boylestad R, Nashelsky L. Electronic Devices and Circuit. India: Pearson Education; 2014.
8. [7] Mokrane M, Lounis M, Announ M, Ouali M, Djebiret MA, Bourouis M. Performance analysis of a micro heat exchanger in electronic cooling applications. J Therm Eng 2021;7:774–790. [CrossRef]

9. [8] Zhang HY, Pinjala D, Teo PS. Thermal management of high power dissipation electronic packages: From air cooling to liquid cooling. Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003:620–625.
10. [9] Tuckerman DB, Pease RFW. High-Performance Heat Sinking for VLSI. IEEE Electron Device Letters 1981;2:126–129. [CrossRef]
11. [10] Chang JY, Park HS, Jo JI, Julia S. A system design of liquid cooling computer based on the micro cooling technology. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2006;2006:157–160.
12. [11] Abdulnabi A, Sameer N, Mohammad H. Numerical and experimental investigation of heat transfer in liquid cooling serpentine mini-channel heat sink with different new configuration models. Therm Sci Eng Progr 2018;6:128–139. [CrossRef]
13. [12] Sahu V, Joshi YK, Fedorov AG. Experimental investigation of hotspot removal using superlattice cooler. 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. [CrossRef]
14. [13] Mandel RK, Bae DG, Ohadi MM. Embedded two-phase cooling of high flux electronics via press-fit and bonded FEEDS coolers. J Electron Pack Trans ASME 2018;140:1–10. [CrossRef]
15. [14] Sohel MR, Saidur R, Sabri MFM, Kamalisarvestani M, Elias MM, Ijam A. Investigating the heat transfer performance and thermophysical properties of nanofluids in a circular micro-channel. Int Commun Heat Mass Transf 2013;42:75–81. [CrossRef]
16. [15] Taşkesen E, Tekir M, Pazarlıoğlu HK, Gurdal M, Gedik E, Arslan K. The effect of MHD flow on hydrothermal characteristics of ferro-nano-fluid in circular pipe. Exp Heat Transf 2022:1–15. [CrossRef]
17. [16] Pazarlıoğlu HK, Gurdal M, Tekir M, Arslan K, Gedik E. Impact of twisted ducts with different twist ratios on heat transfer and fluid characteristics of nio/water nanofluid flow under magnetic field effect. Heat Transf Res 2022;53:55–71. [CrossRef]
18. [17] Pazarlioglu HK, Tekir M. Impact of Fe3O4 / water on Natural Convection in Square Enclosure. Eur J Sci Technol 2021;28:675–683. [CrossRef]
19. [18] Gaikwad VP, More SP. CPU Processor Cooling by using Microchannel Heat Sink with PCM as Coolant Int J Eng Res Technol 2017;6:214–219.
20. [19] Algburi NİH, Pazarlioğlu HK, Arslan K. Effect of pitch ratio and diagonal length of pin fin of heat sink on convective heat transfer for turbulent flow condition. Eur J Sci Technol 2021:643–652. [CrossRef]
21. [20] Pazarlioğlu HK, Ekiciler R, Arslan K. Numerical analysis of effect of impinging jet on cooling of solar air heater with longitudinal fins. Heat Transf Res 2021;52:47–61. [CrossRef]
22. [21] Al-Tae’y KA, Jaddoa AA, Abd HS, Kadhim RA. A loop thermosyphon for liquid cooled minichannels heat sink with pulsate surface heat flux. J Therm Eng 2021;7:1030–1038. [CrossRef]
23. [22] Ghani IA, Sidik NAC, Kamaruzaman N. Hydrothermal performance of microchannel heat sink: The effect of channel design. Int J Heat Mass Transf 2017;107:21–44. [CrossRef]
24. [23] Al-Neama AFM. Serpentine minichannel liquid-cooled heat sinks for electronics cooling applications. [Doctorial Thesis]. The University of Leeds School of Mechanical Engineering Institute of ThermoFluids 2018:298. [CrossRef]
25. [24] Sharma A, Rajoria CS, Singh D, Bhamu JP, Kumar R. Numerical simulation of heat transfer characteristics of taper helical and spiral tube heat exchanger. J Therm Eng 2021;7:1591–1603. [CrossRef]
26. [25] Jilte R, Ahmadi MH, Kumar R, Kalamkar V, Mosavi A. Cooling performance of a novel circulatory flow concentric multi-channel heat sink with nanofluids. Nanomaterials 2020;10:647. [CrossRef]
27. [26] Umehara M, Yamada K, Rossman W. Differential Geometry Of Curves And Surfaces. World Scientific Publishing Company; 2017. [CrossRef]
28. [27] Çengel YA, Ghajar AJ. Heat and Mass Transfer: Fundamentals \& Applications. New York: McGraw Hill Education; 2015.
29. [28] Ozturk E. CFD analyses of heat sinks for cpu cooling with fluent. Madison: CWL Publishing Enterprises, Inc; 2004. p. 352. [CrossRef]
30. [29] Alfonsi G. Reynolds-averaged Navier-Stokes equations for turbulence modeling. Appl Mech Rev 2009;62:1–20. [CrossRef]
31. [30] Menter FR, Kuntz M, Langtry R. ten years of industrial experience with the SST turbulence model. Heat Mass Transf 2003:625632.
32. [31] Rocha PAC, Rocha HHB, Carneiro FOM, Vieira da Silva ME, Bueno AV. K-ω SST (shear stress transport) turbulence model calibration: A case study on a small scale horizontal axis wind turbine. Energy 2014;65:412–418. [CrossRef]
33. [32] Elsaadawy E, Mortazavi H, Hamed MS. Turbulence modeling of forced convection heat transfer in two-dimensional ribbed channels. J Electron Pack 2008:130. [CrossRef]
34. [33] Xu F, Lu H, Chen Z, Guan Z, Chen Y, Shen G, et al. Selection of a computational fluid dynamics (CFD) model and its application to greenhouse pad-fan cooling (PFC) systems. J Clean Prod 2021;302:127013. [CrossRef]
35. [34] Khan MZU, Younis MY, Akram N, Akbar B, Rajput UA, Bhutta RA, et al. Investigation of heat transfer in wavy and dual wavy micro-channel heat sink using alumina nanoparticles. Case Stud Therm Eng 2021;28. [CrossRef]
36. [35] Fan JF, Ding WK, Zhang JF, He YL, Tao WQ. A performance evaluation plot of enhanced heat transfer techniques oriented for energy-saving. Int J Heat Mass Transf 2009;52:33–44. [CrossRef]
37. [36] Dittus FW, Boelter LMK. Heat transfer in automobile radiators of the tubular type. Int Commun Heat Mass Transf 1985;12:3–22. [CrossRef]
38. [37] Liu J, Hussain S, Wang J, Wang L, Xie G, Sundén B. Heat transfer enhancement and turbulent flow in a high aspect ratio channel (4:1) with ribs of various truncation types and arrangements. Int J Therm Sci 2018;123:99–116. [CrossRef]
39. [38] Das L, Rubbi F, Habib K, Saidur R, Islam N, Saha BB, et al. Hydrothermal performance improvement of an inserted double pipe heat exchanger with Ionanofluid. Case Stud Therm Eng 2021;28:101533. [CrossRef]
40. [39] Chatterjee R, Duryodhan VS, Agrawal A. Impact of aspect ratio and thermophysical properties on heat transfer behavior in spiral microchannel. Int J Therm Sci 2022;172:107335. [CrossRef]