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INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES

Year 2020, Volume: 4 Issue: 1, 20 - 28, 11.06.2020

Abstract

Abstract. In the microelectronics, β-Sn (white tin) is the base material of the
solder alloys and surface finishes. The so called “tin pest” phenomenon is the
spontaneous allotropic transition of ß-Sn to the semiconductor α-Sn (gray tin)
below 13.2°C. In this work, different microscopy and spectroscopy techniques
were applied in order to characterize the tin pest phenomenon in the case of
different solder alloys and inoculator materials as well as to study the
applicability of these techniques in tin pest research. Optical imaging
technique were used to compare the surface marks of the allotropic transition
in the case of different inoculator materials. The development of the
transition towards the sample bodies was studied on metallurgical
cross-sections. Electrical resistance measurements were applied in order to
determine the different phases of the transition in the case of different
alloys and inoculators. The grain sliding and α -Sn expansion during the
transition was observed by scanning electron microscopy and focused ion beam - scanning
ionic microscopy. The ratio of the transitioned tin and the duration of the
transition process was determined by Mössbauer spectroscopy. Our results have
shown that the transition phases can considerably differ at the different
alloys and inoculators, like different nucleation, growth and the saturation phase.
The accurate characterization of the transition in the given material
combinations is possible only with the combined application of the applied
analytical methods.

Supporting Institution

National Research, Development and Innovation Office Hungary - NKFIH

Project Number

FK 127970

Thanks

This research was partially supported by National Research, Development and Innovation Office Hungary - NKFIH, project number FK 127970

References

  • [1] A. M. Molodets, S. S. Nabatov, Thermodynamic Potentials, Diagram of State, and Phase Transitions of Tin on Shock Compression, High Temp. 38/5, 715-721, (2000). DOI: 10.1007/BF02755923[2] A. Skwarek, P. Zachariasz, J. Kulawik, K. Witek, Inoculator dependent induced growth of α-Sn, Materials Chemistry and Physics 166, 16-19, (2015). DOI: 10.1016/j.matchemphys.2015.09.017[3] A. Skwarek, B. Illés, B. Horváth, A. Géczy, P Zachariasz, D. Bušek, Identification and caracterization of ß→α-Sn transition in SnCu1 bulk alloy inoculated with InSb, J. Mater. Sci. Mater. Electron. 28, 16329–16335 (2017). DOI: 10.1007/s10854-017-7539-5[4] M. Leodolter-Dworak, I. Stefan, W.J. Plumbridge, H. Ipser, Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements, J. Electron. Mater. 39/1, 105-108, (2010). DOI: 10.1007/s11664-009-0958-1[5] D. Giuranno, S. Delsante, G. Borzone, R. Novakovic, Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems, J. Alloys Compds 689, 918-930 (2016). DOI: 10.1016/j.jallcom.2016.08.035[6] A. Skwarek, M. Sroda, M. Pluska, A. Czerwinski, J. Ratajczak, K. Witek, Occurrence of tin pest on the surface of tin-rich lead-free alloys, Solder. Surf. Mount Tech. 23/3, 184-190 (2011) 184-190. DOI: 10.1108/09540911111146944[7] W.J. Plumbridge, Tin pest issues in lead-free electronic solders, J. Mater. Sci. – Mater. Electron. 18, 307-318, (2007). DOI: 10.1007/978-0-387-48433-4_20[8] K. Zhang, Y. Wang, W. Jin, X. Fang, Y. Wan, Y. Zhang, L. Dai, High-quality InSb nanocrystals: synthesis and application in graphene-based near-infrared photodetectors, RSC Adv. 6/30, 25123-25127, (2016). DOI: 10.1039/C6RA00503A[9] T. Ito, A. Kadoda, K. Nakayama, Y. Yasui, M. Mori, K. Maezawa, T. Mizutani, Effective mobility enhancement in Al2O3/InSb/Si quantum well metal oxide semiconductor field effect transistors for thin InSb channel layers, Jpn. J. App. Phys. 52/4S, 04CF01, (2013). DOI: [10] A.Y. Shenouda, M.M. Rashad, L. Chow, Synthesis, characterization and performance of Cd 1− xInxTe compound for solar cell applications, J. Alloys Compds, 39-43, 563 (2013). DOI: 10.1016/j.jallcom.2013.02.076[11] N. D. Burns, A Tin Pest Failure, J. Failure Anal. Prev. 9/5, 461-465, (2009). DOI: 10.1007/s11668-009-9280-8[12] K. Nogita, C.M. Gourlay, S.D. McDonald, S. Suenaga, J. Read, G. Zeng, Q.F. Gud, XRD study of the kinetics of β↔α transformations in tin, Phil. Mag. 93/27, 3627-3647 (2013). DOI: 10.1080/14786435.2013.820381[13] A. Skwarek, P. Zachariasz, J. Zukrowski, B. Synkiewicz, K. Witek, Early stage detection of ß → α a transition in Sn by Mössbauer spectroscopy, Mater. Chem. Phy. 182, 10-14 (2016). DOI: 10.1016/j.matchemphys.2016.07.061[14] D. Di Maio, C.P. Hunt, Monitoring the Growth of the α Phase in Tin Alloys by Electrical Resistance Measurements, J. Electron. Mater. 38/9, 1874-1880, (2009). DOI: 10.1007/s11664-009-0822-3[15] A. Skwarek, P. Zachariasz, B. Illés, J. Żukrowski, T. Hurtony, K. Witek, Mössbauer studies of f ß→α phase transition in Sn-rich solder alloys, Microelectron. Reliab. 82 (2018) pp. 165-170. DOI: 10.1016/j.microrel.2018.01.016
Year 2020, Volume: 4 Issue: 1, 20 - 28, 11.06.2020

Abstract

Project Number

FK 127970

References

  • [1] A. M. Molodets, S. S. Nabatov, Thermodynamic Potentials, Diagram of State, and Phase Transitions of Tin on Shock Compression, High Temp. 38/5, 715-721, (2000). DOI: 10.1007/BF02755923[2] A. Skwarek, P. Zachariasz, J. Kulawik, K. Witek, Inoculator dependent induced growth of α-Sn, Materials Chemistry and Physics 166, 16-19, (2015). DOI: 10.1016/j.matchemphys.2015.09.017[3] A. Skwarek, B. Illés, B. Horváth, A. Géczy, P Zachariasz, D. Bušek, Identification and caracterization of ß→α-Sn transition in SnCu1 bulk alloy inoculated with InSb, J. Mater. Sci. Mater. Electron. 28, 16329–16335 (2017). DOI: 10.1007/s10854-017-7539-5[4] M. Leodolter-Dworak, I. Stefan, W.J. Plumbridge, H. Ipser, Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements, J. Electron. Mater. 39/1, 105-108, (2010). DOI: 10.1007/s11664-009-0958-1[5] D. Giuranno, S. Delsante, G. Borzone, R. Novakovic, Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems, J. Alloys Compds 689, 918-930 (2016). DOI: 10.1016/j.jallcom.2016.08.035[6] A. Skwarek, M. Sroda, M. Pluska, A. Czerwinski, J. Ratajczak, K. Witek, Occurrence of tin pest on the surface of tin-rich lead-free alloys, Solder. Surf. Mount Tech. 23/3, 184-190 (2011) 184-190. DOI: 10.1108/09540911111146944[7] W.J. Plumbridge, Tin pest issues in lead-free electronic solders, J. Mater. Sci. – Mater. Electron. 18, 307-318, (2007). DOI: 10.1007/978-0-387-48433-4_20[8] K. Zhang, Y. Wang, W. Jin, X. Fang, Y. Wan, Y. Zhang, L. Dai, High-quality InSb nanocrystals: synthesis and application in graphene-based near-infrared photodetectors, RSC Adv. 6/30, 25123-25127, (2016). DOI: 10.1039/C6RA00503A[9] T. Ito, A. Kadoda, K. Nakayama, Y. Yasui, M. Mori, K. Maezawa, T. Mizutani, Effective mobility enhancement in Al2O3/InSb/Si quantum well metal oxide semiconductor field effect transistors for thin InSb channel layers, Jpn. J. App. Phys. 52/4S, 04CF01, (2013). DOI: [10] A.Y. Shenouda, M.M. Rashad, L. Chow, Synthesis, characterization and performance of Cd 1− xInxTe compound for solar cell applications, J. Alloys Compds, 39-43, 563 (2013). DOI: 10.1016/j.jallcom.2013.02.076[11] N. D. Burns, A Tin Pest Failure, J. Failure Anal. Prev. 9/5, 461-465, (2009). DOI: 10.1007/s11668-009-9280-8[12] K. Nogita, C.M. Gourlay, S.D. McDonald, S. Suenaga, J. Read, G. Zeng, Q.F. Gud, XRD study of the kinetics of β↔α transformations in tin, Phil. Mag. 93/27, 3627-3647 (2013). DOI: 10.1080/14786435.2013.820381[13] A. Skwarek, P. Zachariasz, J. Zukrowski, B. Synkiewicz, K. Witek, Early stage detection of ß → α a transition in Sn by Mössbauer spectroscopy, Mater. Chem. Phy. 182, 10-14 (2016). DOI: 10.1016/j.matchemphys.2016.07.061[14] D. Di Maio, C.P. Hunt, Monitoring the Growth of the α Phase in Tin Alloys by Electrical Resistance Measurements, J. Electron. Mater. 38/9, 1874-1880, (2009). DOI: 10.1007/s11664-009-0822-3[15] A. Skwarek, P. Zachariasz, B. Illés, J. Żukrowski, T. Hurtony, K. Witek, Mössbauer studies of f ß→α phase transition in Sn-rich solder alloys, Microelectron. Reliab. 82 (2018) pp. 165-170. DOI: 10.1016/j.microrel.2018.01.016
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Details

Primary Language English
Subjects Electrical Engineering
Journal Section Research Articles
Authors

Balázs Illés

Agata Skwarek This is me

Tamás Hurtony This is me

Piotr Zachariasz This is me

Gábor Harsányi This is me

Project Number FK 127970
Publication Date June 11, 2020
Published in Issue Year 2020 Volume: 4 Issue: 1

Cite

APA Illés, B., Skwarek, A., Hurtony, T., Zachariasz, P., et al. (2020). INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES. Acta Materialia Turcica, 4(1), 20-28.
AMA Illés B, Skwarek A, Hurtony T, Zachariasz P, Harsányi G. INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES. ACTAMAT. June 2020;4(1):20-28.
Chicago Illés, Balázs, Agata Skwarek, Tamás Hurtony, Piotr Zachariasz, and Gábor Harsányi. “INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES”. Acta Materialia Turcica 4, no. 1 (June 2020): 20-28.
EndNote Illés B, Skwarek A, Hurtony T, Zachariasz P, Harsányi G (June 1, 2020) INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES. Acta Materialia Turcica 4 1 20–28.
IEEE B. Illés, A. Skwarek, T. Hurtony, P. Zachariasz, and G. Harsányi, “INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES”, ACTAMAT, vol. 4, no. 1, pp. 20–28, 2020.
ISNAD Illés, Balázs et al. “INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES”. Acta Materialia Turcica 4/1 (June 2020), 20-28.
JAMA Illés B, Skwarek A, Hurtony T, Zachariasz P, Harsányi G. INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES. ACTAMAT. 2020;4:20–28.
MLA Illés, Balázs et al. “INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES”. Acta Materialia Turcica, vol. 4, no. 1, 2020, pp. 20-28.
Vancouver Illés B, Skwarek A, Hurtony T, Zachariasz P, Harsányi G. INVESTIGATION OF ALLOTROPIC β→α-Sn TRANSITION IN HIGH TIN CONTENT SOLDER ALLOYS WITH DIFFERENT MICROSCOPY AND SPECTROSCOPY TECHNIQUES. ACTAMAT. 2020;4(1):20-8.