Abstract. In the microelectronics, β-Sn (white tin) is the base material of the
solder alloys and surface finishes. The so called “tin pest” phenomenon is the
spontaneous allotropic transition of ß-Sn to the semiconductor α-Sn (gray tin)
below 13.2°C. In this work, different microscopy and spectroscopy techniques
were applied in order to characterize the tin pest phenomenon in the case of
different solder alloys and inoculator materials as well as to study the
applicability of these techniques in tin pest research. Optical imaging
technique were used to compare the surface marks of the allotropic transition
in the case of different inoculator materials. The development of the
transition towards the sample bodies was studied on metallurgical
cross-sections. Electrical resistance measurements were applied in order to
determine the different phases of the transition in the case of different
alloys and inoculators. The grain sliding and α -Sn expansion during the
transition was observed by scanning electron microscopy and focused ion beam - scanning
ionic microscopy. The ratio of the transitioned tin and the duration of the
transition process was determined by Mössbauer spectroscopy. Our results have
shown that the transition phases can considerably differ at the different
alloys and inoculators, like different nucleation, growth and the saturation phase.
The accurate characterization of the transition in the given material
combinations is possible only with the combined application of the applied
analytical methods.
National Research, Development and Innovation Office Hungary - NKFIH
FK 127970
This research was partially supported by National Research, Development and Innovation Office Hungary - NKFIH, project number FK 127970
FK 127970
Primary Language | English |
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Subjects | Electrical Engineering |
Journal Section | Research Articles |
Authors | |
Project Number | FK 127970 |
Publication Date | June 11, 2020 |
Published in Issue | Year 2020 Volume: 4 Issue: 1 |