THERMAL CONDUCTIVITY and TENSILE PROPERTIES OF HOLLOW GLASS MICROSPHERE / POLYPROPYLENE COMPOSITES

Year 2017, Volume: 18 Issue: 3, 746 - 753, 30.09.2017

Hande Çelebi

https://doi.org/10.18038/aubtda.323483

Cited By: 2

Abstract

In
this study, hollow glass microspheres (HGM) filled polypropylene (PP)
composites were prepared by melt extrusion method. In order to understand the
effect of structure and physical properties on the performance of composites,
the morphologies, tensile properties and thermal conductivities of composites
were investigated.  The surface of HGMs
were modified with 3-(Trimethoxysilyl) propyl methacrylate (TMSM)
silane coupling agent to improve the compatibility between PP matrix and HGMs.
The physical properties of silane modified and unmodified HGMs were
characterized by Fourier Transform Infrared Spectroscopy (FT-IR) and Scanning Electron Microscope (SEM). The effect of HGM content and surface
modification of HGM on morphological, mechanical and thermal conductivity
properties of composites were evaluated. The
results indicated that the surface modification of HGM enhance the interfacial
region between HGM and polymer matrix. When 20 wt % modified HGM was added to
neat PP, the modulus of the composite obtained was 1057 MPa, increasing by
15.1% compared with that of the PP/unmodified HGM composite.  However, any positive or consistent effect of surface
modification and HGM addition on thermal conductivity of samples can not be
observed.  

Keywords

polypropylene, hollow glass microspheres, composite, thermal conductivity

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