MEMS Malzeme Karakterizasyonu için Bütünleşik bir Elektrostatik Mikro Bükülme Test Yapısı Tasarımı ve Gerçekleştirilmesi

Year 2012, Volume: 9 Issue: 1, - , 01.02.2012

Ender Yıldırım Tayfun Akın M. A. Sahir Arıkan

https://izlik.org/JA38FW25JM

Abstract

Because of the fabrication techniques, mechanical properties of the materials
used in micro electromechanical systems should be determined by utilizing micro-scale test
structures. In this study, a micro bending test structure, whose actuator, sample, and readout
scale are integrally fabricated on a single chip is presented. Integrated fabrication of all
components eliminates the alignment problem observed in similar systems. The structure
relies on the principle of bending a double-clamped beam from its center by using an
electrostatic comb drive. Deflection amount is determined by using image processing
techniques on the read-out scale. Designed structures are fabricated by using silicon-oninsulator
wafers. As a result of the tests, elastic modulus of silicon is determined as 136
GPa in accordance with the literature. 

Keywords

Micro electromechanical systems , material characterization , electrostatic actuator

References

• [1] T. Yi and C.-J. Kim, Measurement of mechanical properties for MEMS materials, Measurement Science and Technology 10 (1999), 706–716.
• [2] T. Tsuchiya, Evaluation of mechanical properties of MEMS materials and their standardization, Reliability of MEMS, Wiley-VCH 2008, 1–25.
• [3] M. A. Haque and M. T. A. Saif, Microscale materials testing using MEMS actuators, Journal of Microelectromechanical Systems 10 (2001), 146–152.
• [4] M. A. Haque and M. T. A. Saif, Mechanical behavior of 30-50 nm thick aluminum films under uniaxial tension, Scripta Materialia 47 (2002), 863–867.
• [5] T. P. Weihs, S. Hong, J. C. Bravman and W. D. Nix, Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films, Journal of Materials Research 3 (1988), 931–942.
• [6] S.-H. Lee, J. W. Evans, Y. E. Pak, J. U. Jeon and D. Kwon, Evaluation of elastic modulus and yield strength of Al film using an electrostatically actuated test device, Thin Solid Films 408 (2002), 223–229.
• [7] E. Yildirim, Development of Test Structures and Methods for Characterization of MEMS Materials, Master Thesis, Middle East Technical University, Ankara 2005.
• [8] S. D. Senturia, Microsystem Design, Springer 2001.
• [9] W. Young, R. Budynas and A. Sadegh, Roark’s Formulas for Stress and Strain, Mcgraw-Hill 2011.
• [10] M. A. Hopcroft, W. D. Nix and T. W. Kenny, What is the Young’s modulus of silicon? Journal of Microelectromechanical Systems 19 (2010), 229–238.