Because of the fabrication techniques, mechanical properties of the materials
used in micro electromechanical systems should be determined by utilizing micro-scale test
structures. In this study, a micro bending test structure, whose actuator, sample, and readout
scale are integrally fabricated on a single chip is presented. Integrated fabrication of all
components eliminates the alignment problem observed in similar systems. The structure
relies on the principle of bending a double-clamped beam from its center by using an
electrostatic comb drive. Deflection amount is determined by using image processing
techniques on the read-out scale. Designed structures are fabricated by using silicon-oninsulator
wafers. As a result of the tests, elastic modulus of silicon is determined as 136
GPa in accordance with the literature.
Subjects | Engineering |
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Journal Section | Articles |
Authors | |
Publication Date | February 1, 2012 |
Published in Issue | Year 2012 Volume: 9 Issue: 1 |