Research Article

DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER

Volume: 9 Number: 2 December 30, 2019
EN

DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER

Abstract

In this study, the performances of the heat transfer fins during the solidification processes of PCM and nano-PCMS(Al2O3 - CuO)  were investigated. These two situations were considered for both with and without fins. Two different heat transfer fins were considered in the study.  The investigation was carried out using both experimental (for Base-PCM) and numerical methods. The results showed that the effects of heat transfer fins were limited due to the overcooling effect of PCMs. The solidification process of Base-PCM in the heat storage tank ended in 10 minutes, while the solidification time of the PCM was determined as 11 minutes by using the Fin 1 design. The solidification process in the heat storage tank with nano-PCM (CuO) was realized in 13 minutes with the Fin 1 design.


Keywords

References

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Details

Primary Language

English

Subjects

Metrology, Applied and Industrial Physics

Journal Section

Research Article

Authors

Publication Date

December 30, 2019

Submission Date

November 4, 2019

Acceptance Date

December 4, 2019

Published in Issue

Year 2019 Volume: 9 Number: 2

APA
Kok, B. (2019). DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER. European Journal of Technique (EJT), 9(2), 263-274. https://doi.org/10.36222/ejt.642684
AMA
1.Kok B. DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER. EJT. 2019;9(2):263-274. doi:10.36222/ejt.642684
Chicago
Kok, Beşir. 2019. “DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER”. European Journal of Technique (EJT) 9 (2): 263-74. https://doi.org/10.36222/ejt.642684.
EndNote
Kok B (December 1, 2019) DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER. European Journal of Technique (EJT) 9 2 263–274.
IEEE
[1]B. Kok, “DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER”, EJT, vol. 9, no. 2, pp. 263–274, Dec. 2019, doi: 10.36222/ejt.642684.
ISNAD
Kok, Beşir. “DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER”. European Journal of Technique (EJT) 9/2 (December 1, 2019): 263-274. https://doi.org/10.36222/ejt.642684.
JAMA
1.Kok B. DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER. EJT. 2019;9:263–274.
MLA
Kok, Beşir. “DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER”. European Journal of Technique (EJT), vol. 9, no. 2, Dec. 2019, pp. 263-74, doi:10.36222/ejt.642684.
Vancouver
1.Beşir Kok. DETERMINING EFFECTS OF HEAT TRANSFER FINS ON THE SOLIDIFICATION PROCESS OF PCM AND NANO-PCM WITH A RECTANGULAR COOLER. EJT. 2019 Dec. 1;9(2):263-74. doi:10.36222/ejt.642684

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