EN
New Copper(II) and Nickel(II) Complexes with Dimethylglyoxime and Amino-acids: Synthesis, Characterization and Electrochemical Properties
Abstract
Four new Cu(II) and Ni(II) ion complexes were created from the interaction of dimethylglyoxime as primary ligand and methionine or alanine as a secondary ligand, has been investigated using molar conductivity, infrared, UV/vis. The electrochemical behavior of these complexes was determined by cyclic voltammetry.The compounds prepared are solids, insoluble in water, ethanol and methanol, but soluble in dimethylsulfoxide (DMSO) and dimethylformamide (DMF). The molar conductance data confirm that two complexes are not electrolytic. The IR study shows that dimethylglyoxime ligand is coordinated to the metal ion in a bidentate manner with NN donor sites of the oxime function, where the secondary ligand is coordinated by the carboxylate oxygen and the N atom of the amino acid. The electronic spectral data indicated that the synthesized complexes have octahedral or square-planar geometries. An electrochemical application was carried out on these mixed complexes in order to study their redox properties, which indicated an irreversible oxidation corresponding of M to M(I) and of M(I) to M(II).
Keywords
References
- Bougherra, H., & Berradj, O, (2025). New copper (II) and nickel (II) complexes with dimethylglyoxime and amino -acids: Synthesis, characterization and electrochemical properties. The Eurasia Proceedings of Science, Technology, Engineering and Mathematics (EPSTEM), 34, 23-30.
Details
Primary Language
English
Subjects
Materials Science and Technologies
Journal Section
Conference Paper
Early Pub Date
August 1, 2025
Publication Date
August 1, 2025
Submission Date
January 15, 2025
Acceptance Date
March 13, 2025
Published in Issue
Year 2025 Volume: 34
APA
Bougherra, H., & Berradj, O. (2025). New Copper(II) and Nickel(II) Complexes with Dimethylglyoxime and Amino-acids: Synthesis, Characterization and Electrochemical Properties. The Eurasia Proceedings of Science Technology Engineering and Mathematics, 34, 23-30. https://doi.org/10.55549/epstem.1747830