Objectives: This in-vitro study was performed to assess the effect of ultrasonic agitation on microtensile bond strength [µTBS] of composite resin cements or self adhesive resin cements used for cementing ceramic inlays.
Materials and Methods: In the study, standardized Class 1 cavities were prepared on 72 human premolar teeth and impression was taken using elastomeric impression material. IPS e-max Press inlay restorations were prepared according to manufacturer’s instruction. HF acid [9.5%] and silane coupling agent was applied to the cementation surfaces of ceramic inlays. Firstly, teeth were randomly divided into four groups for four different resin cements [RelyX ARC, Panavia F 2.0, RelyX U200 and G-Cem] . And then, each resin cement group was divided into two subgroups according to the cementation by finger pressure or ultrasonic agitation. While 64 teeth were used for microtensile bond strength test, 8 teeth [including one in each group] were used for scanning electron microscopy evaluation. At the end of the microtensile test, samples were examined using a stereomicroscope for analysis of fracture type.
Results: The microtensile bond strengths of conventional resin cements [RelyX ARC and Panavia F 2.0] were significantly higher than self adhesive resin cements’ [RelyX U200 and G-Cem] bond strengths [p < 0.05] . In each cements’ subgroups, the two cementation techniques did not effect the microtensile bond strength of each cements [p > 0,05] . The effect of ultrasonic agitation on microtensile bond strength of resin cements was not statistically significant for all groups.
Conclusions: In the present study, the best bonding performances were achieved with the etch-and-rinse and self-etch systems. Ultrasonic agitation did not influence the microtensile bond strength of resin cements.
DÜAPK-Dicle University Research Project Council
[DUBAP] -12-DH-05.
[DUBAP] -12-DH-05.
Primary Language | English |
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Subjects | Dentistry |
Journal Section | Original Articles |
Authors | |
Project Number | [DUBAP] -12-DH-05. |
Publication Date | June 19, 2021 |
Published in Issue | Year 2021 Volume: 5 Issue: 1 |