The features of the formation of microconnections in electronic modules
on an aluminum-polyimide basis by the method of ultrasonic welding, which
allows to obtain reliable mounting joints of different thickness aluminum
without preliminary removal of oxide films where the use of contact welding and
soldering are practically difficult or impossible, are investigated. The influence of technological modes (power
of an ultrasonic generator, oscillation amplitude of a welding tip (tool),
welding force and welding time) on the reliability of mounting microconnections
is considered
Primary Language | English |
---|---|
Subjects | Engineering |
Journal Section | Articles |
Authors | |
Publication Date | December 16, 2019 |
Published in Issue | Year 2019 Volume: 20 |