Kaplamalı Terminal Blok Ucunda Tasarımsal Değişim Yapılarak Mekanik Özelliklerinin Araştırılması

Year 2022, Volume: 8 Issue: 1, 103 - 109, 30.04.2022

Mert Onan , Ahmet Celal Topkaya , Eyyüp Öksüztepe

Abstract

Otomotiv ve beyaz eşya sektöründe kullanılan bakır alaşımlarının iletkenlikleri yüksek olmasından dolayı terminal olarak tercih edilmektedir. Bakır alaşımlarının düşük kontak direnci, yüksek mekanik dayanım için uygun tasarım seçimi önemli hale gelmektedir. Bakır alaşımın kaplanması neticesinde iletken terminalin akım geçiş seviyesi ve yüzeyde korozyondan koruyan film oluşumu geliştirilmektedir. Bu çalışma da amaç CuNiSiP malzemeden imal edilecek PCB terminallerinin kontak kuvvetlerine göre optimize etmek ve altın kaplamalı olarak üretmektir. Yapılan Sonlu Elemanlar Analizleri ile farklı kontak çapı ve ağız boşluğu parametrelerine göre kontak kuvvetleri hesaplanmıştır. Tasarım sonrası ürün kontak noktalarında yüzey pürüzlülüğünün düşük olduğu ölçülmüştür. Kesme bölgesindeki yüzey pürüzlülük verileri devir sayısına bağlı olarak prototip üretim sonrası tekrar kıyaslanmıştır. Terminal ucu hassas bölgesinde Elektron Mikroskobisi ile karakterize edilmiştir. Karakterizasyon sonrası altın kaplanan bölgelerin kaplama kalınlığı min. 0.8 µm X-ray cihazında ölçülmüştür. Üretilen PCB terminalinin kontak kuvvetlerinin gereksinimleri karşıladığı deneysel olarak ispatlanmıştır.

Keywords

terminal, Sonlu Elemanlar Analizi, Altın Kaplama, Mekanik Özellikler, CuNiSiP

Supporting Institution

Türkiye Bilimsel ve Teknolojik Araştırma Kurumu

Project Number

TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183)

Thanks

Bu çalışma, TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183) kapsamında Türkiye Bilimsel ve Teknolojik Araştırma Kurumu (TÜBİTAK) tarafından desteklenmiştir. Test ve analizlerde yardımını esirgemeyen Hatko Teknik Donanımlar Müm. ve Tic. A.Ş. birimlerine teşekkür ederiz.

Investigation of Mechanical Properties on Coated Terminal Tip by Co-design

Abstract

Copper alloys used in the automotive and white goods industry are preferred as terminals due to their high conductivity For low contact resistance and high mechanical strength of copper alloys, appropriate design selection becomes important. As a result of the coating of copper alloy, current transition level of the conductive terminal and the formation of a film that protects against corrosion on the surface are improved. The aim is to optimize the PCB terminals to be made of CuNiSiP material according to the contact forces and to produce them as gold-plated. Production is done for the CuNiSiP copper alloy supplied within the developing dimensions. With the FEA, contact forces were calculated according to different contact diameter and oral cavity parameters. The surface roughness was measured from the product contact point after the final design. The surface roughness data in the cutting zone were compared again after the prototype production, depending on the number of cycle period. During prototype production, sensitive area of terminal tip was characterized by Electron Microscopy. After the characterization, coating thickness of gold-plated regions was measured as minumum 0.8 µm by X-ray Analyses. It is experimentally proven that contact forces of PCB terminal meet the requirements.

Keywords

Terminal, CuNiSiP, Finite Element Analyses, Gold-plated, Mechanical Properties

Project Number

TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183)

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