Case Study for Thermo Mechanical Performance of an Integrated Optic Device via Equation-Based Modelling

Abstract

An integrated optical device was modeled in the simulation environment via Comsol software. Model implementation, meshing analysis, the definition of material parameters, analyze and module type was introduced, respectively. At the end of this paper; it was understood that the connection of the bodies with different thermal expansion coefficients causes thermal stress accumulation and deformation. The acquired results reveal that fiber-based components can be analyzed with the contribution of the simulation interface. The literature researches were examined in detail and it was found that no study discusses the modeling of the full structure of the fiber optic integrated optic device. So; this study is crucial because it explains how to model an integrated optic device via simulations and leads the researchers about how to make complex meshing analysis in the presence of thin epoxy layers.

Keywords

• Integrated Optical Device
• Multiphysics
• Finite Element Analysis

References

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