Research Article

Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†

Volume: 8 Number: 1 March 31, 2021
  • Merve Acar
  • Soheil Mobtakeri
  • Mehmet Ertuğrul
  • Emre Gür
EN

Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†

Abstract

Transition metal dichalcogenide (TDMCs) placed on a 3D semiconductor substrate haveleads to significant advances in the electronic industry with new opportunities based on 2D/3D heterojunction based diverse devices without any restrictions, such as lattice compatibility. In this study, magnetron sputtering technique was used to grow layered tungsten disulfide (WS2) thin films onto p-Si and thus WS2/p-Si heterojunctions were created. The structural and chemical parameters of this sputtered WS2 films were investigated using Raman spectroscopy, X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Electrical characterization of WS2/p-Si heterojunction was also obtained to investigate Log (I)-V and linear I-V characteristics. A typical diode like I-V behavior was observed with a five-ordered rectifying ratio. It was observed that the heterojunction has a barrier height of 0.48 eV, the leakage current at -0.2 V is 2.25×10-6 A and the ideality factor is 5.7. This work show that single step magnetron sputtering WS2/p-Si heterojunction has great importance for heterojunction based future nanoelectronic devices.

Keywords

References

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Details

Primary Language

English

Subjects

Engineering

Journal Section

Research Article

Authors

Soheil Mobtakeri This is me
0000-0003-3089-6162
Türkiye

Mehmet Ertuğrul This is me
0000-0003-1921-7704
Türkiye

Publication Date

March 31, 2021

Submission Date

May 30, 2020

Acceptance Date

December 27, 2020

Published in Issue

Year 2021 Volume: 8 Number: 1

APA
Acar, M., Mobtakeri, S., Ertuğrul, M., & Gür, E. (2021). Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†. Hittite Journal of Science and Engineering, 8(1), 1-5. https://doi.org/10.17350/HJSE19030000206
AMA
1.Acar M, Mobtakeri S, Ertuğrul M, Gür E. Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†. Hittite J Sci Eng. 2021;8(1):1-5. doi:10.17350/HJSE19030000206
Chicago
Acar, Merve, Soheil Mobtakeri, Mehmet Ertuğrul, and Emre Gür. 2021. “Fabrication and Analysis Of 2D 3D Heterojunction Between Continuous Few-Layer WS2 Film and Si (100)†”. Hittite Journal of Science and Engineering 8 (1): 1-5. https://doi.org/10.17350/HJSE19030000206.
EndNote
Acar M, Mobtakeri S, Ertuğrul M, Gür E (March 1, 2021) Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†. Hittite Journal of Science and Engineering 8 1 1–5.
IEEE
[1]M. Acar, S. Mobtakeri, M. Ertuğrul, and E. Gür, “Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†”, Hittite J Sci Eng, vol. 8, no. 1, pp. 1–5, Mar. 2021, doi: 10.17350/HJSE19030000206.
ISNAD
Acar, Merve - Mobtakeri, Soheil - Ertuğrul, Mehmet - Gür, Emre. “Fabrication and Analysis Of 2D 3D Heterojunction Between Continuous Few-Layer WS2 Film and Si (100)†”. Hittite Journal of Science and Engineering 8/1 (March 1, 2021): 1-5. https://doi.org/10.17350/HJSE19030000206.
JAMA
1.Acar M, Mobtakeri S, Ertuğrul M, Gür E. Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†. Hittite J Sci Eng. 2021;8:1–5.
MLA
Acar, Merve, et al. “Fabrication and Analysis Of 2D 3D Heterojunction Between Continuous Few-Layer WS2 Film and Si (100)†”. Hittite Journal of Science and Engineering, vol. 8, no. 1, Mar. 2021, pp. 1-5, doi:10.17350/HJSE19030000206.
Vancouver
1.Merve Acar, Soheil Mobtakeri, Mehmet Ertuğrul, Emre Gür. Fabrication and Analysis Of 2D/3D Heterojunction Between Continuous Few-layer WS2 Film and Si (100)†. Hittite J Sci Eng. 2021 Mar. 1;8(1):1-5. doi:10.17350/HJSE19030000206

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