Enhancing Radiator Cooling with CuO Nanofluid Microchannels

Year 2024, Volume: 8 Issue: 2, 201 - 211, 30.06.2024

Shalom Akhai , Amandeep Wadhwa

https://doi.org/10.30939/ijastech..1399702

Abstract

The study explores in employing copper oxide (CuO) nanofluid as a cooling medium in the vehicle radiators. To simulate the heat transfer process, the microchannel is constructed using elec-tron discharge machining (EDM) and a computational fluid dynamics (CFD) modeling is em-ployed. UV-visible spectroscopy, scanning electron microscopy (SEM), and dynamic light scat-tering (DLS) are used to characterize the CuO nanofluid. CuO nanofluid surpasses water in the heat transfer capabilities, with a 40% improvement in thermal conductivity. The average size of CuO nanoparticles was determined via DLS to be 485.1 nm. The heat transfer coefficient of CuO nanofluid is 5366 W/m2K, which is 116% larger than that of water. The increased heat transfer capabilities of CuO nanofluid microchannel flow indicate to its potential as a viable replacement for conventional radiators in the automotive applications. Lower engine tempera-tures, increased fuel efficiency, and longer engine lifespan may result from improved cooling performance. Due of the small size of microchannels, more efficient and space-saving radiators for automobiles are conceivable. More research is needed to improve the microchannel design as well as to realize the practical benefits of CuO nanofluids in car cooling systems.

Keywords

CFD, COMSOL, Electron discharge machining, Micro-channel, Nano fluid

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