İLETİM TABANLI SONLU ELEMANLAR YÖNTEMİ KULLANILARAK YENİ BİR MODELLEME YAKLAŞIMI İLE BİR ELEKTRONİK KARTININ ISIL PERFORMANSININ İNCELENMESİ

Abstract

Elektronik sistemler, artan güç tüketimiyle birlikte sanayinin hemen her alanında kullanılmaktadır. Bu eğilim, elektronik elemanların düzgün çalışması için termal yönetimini zorunlu kılmaktadır. Elektronik elemanların termal davranışını incelemek için çeşitli yöntemler kullanılmaktadır. Isı transferi analizi için İletim Tabanlı Sonlu Elemanlar Yöntemi (SEY) bunlardan biridir; Kısa çözüm sürelerinde doğru çözümler sunması öne çıkan avantajlarından biridir. Bununla birlikte, sistemin içindeki veya etrafındaki akışkan (elektronik sistemler için genellikle hava), doğrudan iletim tabanlı SEY analiz modeline dahil edilmez. Bu çözüm doğruluğu açısından önemli bir eksikliktir. Bu dezavantajın aşılması durumunda, iletim tabanlı SEY, özellikle doğal taşınım altındaki geçici problemler için tercih edilen bir analiz yöntemi haline gelecektir. Bu çalışmada, zamana bağlı doğal konveksiyon altında bir kapalı ortam içinde iki ısı kaynağına sahip bir elektronik kartın iletim tabanlı SEY analiz modeli geliştirilmiştir. Modelin prosedürü bilinmeyen parametrelerinin düzeltilmesini içermektedir. Sonuçları düzeltme işlemi için referans değerleri olarak kullanılan deneysel bir araştırma gerçekleştirilmiştir. Bu bilinmeyen parametreler iteratif olarak belirlenmiştir. Analiz sonuçları ile deneyin sonuçları eşleşene kadar iterasyona devam edildi. Analiz sonuçları ile deneysel sonuçlar arasındaki fark 2-3°C’nin altında olduğu tespit edilmiştir. Son analiz modeli kullanılarak elektronik kart üzerinde bazı parametrik termal incelemeler gerçekleştirilmiştir.

Keywords

• İletim Tabanlı sonlu elemanlar yöntemi
• Deney
• Doğal Konveksiyon
• Isıl Yönetim

INVESTIGATIONS ON THERMAL PERFORMANCE OF AN ELECTRONIC BOARD USING CONDUCTION-BASED FINITE ELEMENT METHOD WITH A NEW MODELING APPROACH

Abstract

Electronic systems are used in almost all areas of industry, with an increasing power consumption rate. This trend makes thermal management of electronics compulsory in order for proper operation. Several methods can be employed to examine electronics’ thermal behavior. Conduction-based Finite Element Method (FEM) for heat transfer analysis is one of them; providing accurate solutions within short solution times is one of its outstanding advantages. Nevertheless, the fluid inside or around the system, usually air for electronic systems, is not included directly in the conduction-based FEM analysis model. This is an essential deficiency in terms of solution accuracy. If this drawback is overcome, conduction-based FEM will become a preferred analysis method, especially for transient problems under natural convection. In this study, a conduction-based FEM analysis model of an electronic board with two heat-dissipating components inside an enclosure under transient natural convection was developed. The procedure of the model involves the correction of unknown input parameters. An experimental investigation was performed, the results of which were used as reference values for the correction process. These unknown parameters were determined iteratively. The iteration was continued until the results of the analysis and those of the experiment matched. The difference between the results of the analysis and those of the experiment was less than 2-3°C. Some parametrical thermal investigations were performed on the electronic board using the final analysis model.

Keywords

• Conduction-based finite element method (FEM)
• experiment
• natural convection
• thermal management

Supporting Institution

Roketsan

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