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ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK

Year 2009, Volume: 9 Issue: 1, 797 - 800, 14.02.2012

Necmi Serkan Tezel

Abstract

   

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Year 2009, Volume: 9 Issue: 1, 797 - 800, 14.02.2012

Necmi Serkan Tezel

Abstract

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Primary Language English
Authors

Necmi Serkan Tezel This is me

Publication Date February 14, 2012
Published in Issue Year 2009 Volume: 9 Issue: 1

Cite

APA Tezel, N. S. (2012). ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK. IU-Journal of Electrical & Electronics Engineering, 9(1), 797-800.
AMA Tezel NS. ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK. IU-Journal of Electrical & Electronics Engineering. February 2012;9(1):797-800.
Chicago Tezel, Necmi Serkan. “ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK”. IU-Journal of Electrical & Electronics Engineering 9, no. 1 (February 2012): 797-800.
EndNote Tezel NS (February 1, 2012) ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK. IU-Journal of Electrical & Electronics Engineering 9 1 797–800.
IEEE N. S. Tezel, “ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK”, IU-Journal of Electrical & Electronics Engineering, vol. 9, no. 1, pp. 797–800, 2012.
ISNAD Tezel, Necmi Serkan. “ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK”. IU-Journal of Electrical & Electronics Engineering 9/1 (February2012), 797-800.
JAMA Tezel NS. ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK. IU-Journal of Electrical & Electronics Engineering. 2012;9:797–800.
MLA Tezel, Necmi Serkan. “ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK”. IU-Journal of Electrical & Electronics Engineering, vol. 9, no. 1, 2012, pp. 797-00.
Vancouver Tezel NS. ONE DIMENSIONAL PROFILE RECONSTRUCTION OF DIELECTRIC CYLINDER BY USING NEURAL NETWORK. IU-Journal of Electrical & Electronics Engineering. 2012;9(1):797-800.