APA |
Canseven, A. G., Tohumoglu, G., Çevik, A., Seyhan, N. (2012). MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS. IU-Journal of Electrical & Electronics Engineering, 7(2), 443-458. |
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AMA |
Canseven AG, Tohumoglu G, Çevik A, Seyhan N. MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS. IU-Journal of Electrical & Electronics Engineering. January 2012;7(2):443-458. |
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Chicago |
Canseven, Ayşe G., Gülay Tohumoglu, Abdükadir Çevik, and Nesrin Seyhan. “MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS”. IU-Journal of Electrical & Electronics Engineering 7, no. 2 (January 2012): 443-58. |
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EndNote |
Canseven AG, Tohumoglu G, Çevik A, Seyhan N (January 1, 2012) MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS. IU-Journal of Electrical & Electronics Engineering 7 2 443–458. |
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IEEE |
A. G. Canseven, G. Tohumoglu, A. Çevik, and N. Seyhan, “MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS”, IU-Journal of Electrical & Electronics Engineering, vol. 7, no. 2, pp. 443–458, 2012. |
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ISNAD |
Canseven, Ayşe G. et al. “MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS”. IU-Journal of Electrical & Electronics Engineering 7/2 (January 2012), 443-458. |
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JAMA |
Canseven AG, Tohumoglu G, Çevik A, Seyhan N. MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS. IU-Journal of Electrical & Electronics Engineering. 2012;7:443–458. |
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MLA |
Canseven, Ayşe G. et al. “MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS”. IU-Journal of Electrical & Electronics Engineering, vol. 7, no. 2, 2012, pp. 443-58. |
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Vancouver |
Canseven AG, Tohumoglu G, Çevik A, Seyhan N. MODELING ELF ELECTROMAGNETIC FIELD EFFECTS ON SKIN’S HYDROXYPROLINE LEVEL USING NEURAL NETWORKS. IU-Journal of Electrical & Electronics Engineering. 2012;7(2):443-58. |
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