The Effects of Some Synthetic Adhesives on the Formaldehyde Emission of the Particleboard

Year 2019, Volume: 4 Issue: 3, 376 - 379, 30.12.2019

Mehmet Baharoğlu

https://doi.org/10.35229/jaes.611767

Abstract

The formaldehyde emission is the one of the
major problems of the particleboard industry that harms to human health and
environment. The purpose of this study was to determine the effect of the
adhesive type on the formaldehyde emission of three-layered particleboard. The urea
formaldehyde (UF), phenol formaldehyde (PF) and melamine-urea formaldehyde (MUF)
adhesives were used as adhesives. Black poplar (Populus nigra) was used as wood raw material. The panels produced
with PF and MUF adhesives had the required level of formaldehyde emission value
specified in EN 312-2 (1996) and these panels could be classified as E-1 grade
particleboard. The particleboard samples produced with UF adhesive had more
than the formaldehyde emission value required for E-1 class particleboards. 

Keywords

environment, particleboard, formaldehyde emission, thermosetting adhesives

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