The formaldehyde emission is the one of the
major problems of the particleboard industry that harms to human health and
environment. The purpose of this study was to determine the effect of the
adhesive type on the formaldehyde emission of three-layered particleboard. The urea
formaldehyde (UF), phenol formaldehyde (PF) and melamine-urea formaldehyde (MUF)
adhesives were used as adhesives. Black poplar (Populus nigra) was used as wood raw material. The panels produced
with PF and MUF adhesives had the required level of formaldehyde emission value
specified in EN 312-2 (1996) and these panels could be classified as E-1 grade
particleboard. The particleboard samples produced with UF adhesive had more
than the formaldehyde emission value required for E-1 class particleboards.
environment particleboard formaldehyde emission thermosetting adhesives
Birincil Dil | İngilizce |
---|---|
Bölüm | Makaleler |
Yazarlar | |
Yayımlanma Tarihi | 30 Aralık 2019 |
Gönderilme Tarihi | 27 Ağustos 2019 |
Kabul Tarihi | 30 Ekim 2019 |
Yayımlandığı Sayı | Yıl 2019 Cilt: 4 Sayı: 3 |