Optimization and Performance Analysis of Single-Phase Micro Pin Fin Heat Sinks: A Case Review

Year 2025, Volume: 2 Issue: 2, 82 - 90, 22.01.2026

Merdin Danışmaz

Abstract

This case review offers a comprehensive overview of design optimization, experimental investigations, and numerical simulations related to single-phase, fluid-cooled Micro Pin Fin Heat Sinks (MPFHS) for thermal management in high-power electronic systems. It emphasizes the importance of key parameters such as Nusselt number (Nu), pressure drop (Δp), friction factor (f), and thermohydraulic performance (THP) in evaluating system efficiency. The review carefully explores how various geometric features, including pin cross-sectional shape, fin arrangement, perforation, and lateral spacing, influence heat transfer and fluid flow. Notably, circular pin fins generally outperform square ones in heat transfer performance but tend to have higher frictional losses. Both inline and staggered configurations offer distinct advantages depending on application needs, with tip clearance emerging as a critical factor for enhancing thermal performance; optimized clearance values can significantly improve heat dissipation. The analysis also highlights ongoing challenges in consistently defining hydraulic diameter for MPFHS, discussing multiple approaches such as the minimum cross-sectional area method, pin dimension-based formulas, the tube bundle method, and heat exchanger models. By comparing experimental data and computational analyses, the review aims to establish optimal design ranges and correlations, providing valuable insights for researchers and engineers working towards advanced, efficient cooling solutions for increasingly complex electronic systems.

Keywords

Micro Pin Fin Heat Sinks , Thermal performance , Hydraulic diameter , Heat transfer , Fluid flow , Geometric optimization , Electronic cooling.

References

• Ahmed M. and Patel S., 2023, Optimization of airflow behavior in microchannel heat sinks for high-performance electronics cooling, IEEE Transactions on Components, Packaging and Manufacturing Technology, 13, 575-584.
• Chen Y. and Zhou H., 2020, Reynolds number effects on vortex formation and heat transfer in micro pin fins, International Journal of Heat and Mass Transfer, 167, 120865.
• Choi J. S. and Patel N., 2023, Vortex interaction mechanisms in complex micro pin fin arrays, Physics of Fluids, 35, 067105.
• Danışmaz M. (2025). Geometric analysis of pin fin heat sinks: Effects of ellipticity and perforation for fin on heat transfer. Case Studies in Thermal Engineering, 106918. https://doi.org/10.1016/j.csite.2025.106918
• Danışmaz M., & Akdağ Ü. (2025). Enhancing heat transfer performance in elliptical tubes with nano fluids: A numerical case study. Numerical Heat Transfer, Part A: Applications, 1-15. https://doi.org/10.1080/10407782.2025.2525315
• Danışmaz, M., & Demirbilek M. (2024). Assessment of heat transfer capabilities of some known nanofluids under turbulent flow conditions in a five-turn spiral pipe flow. Applied Rheology, 34(1), 20240002. https://doi.org/10.1515/arh-2024-0002
• Fernández A. and Ríos M. J., 2019, Flow and heat transfer in complex micro pin fin structures, Physics of Fluids, 31, 042002.
• Hasan M. F., Danışmaz M., & Majel, B. M. (2023). Thermal performance investigation of double pipe heat exchanger embedded with extended surfaces using nanofluid technique as enhancement. Case Studies in Thermal Engineering, 43, 102774. https://doi.org/10.1016/j.csite.2023.102774
• Kim J. K. and Lee S. H., 2022, Advances in microchannel and micro pin fin heat sink technology, International Journal of Heat and Mass Transfer, 180, 121797.
• Kumar A. and Singh S. K., 2022, Additive manufacturing-enabled design of micro pin fin heat sinks, Additive Manufacturing, 51, 102356.
• Korhonen M. O. and Korpela J. M., 2023, Performance of innovative pin fin geometries in microchannel cooling, Microelectronics Reliability, 132, 114679.
• Li F. and Chen X., 2022, Influence of pitch and aspect ratio on micro pin fin heat sink performance, International Journal of Thermal Sciences, 164, 107194. https://doi.org/10.1016/j.applthermaleng.2022.118085
• Li Y., Zhang H. and Wang Q., 2020, Numerical investigation of airflow in micro pin fin heat sinks with varying geometries, International Journal of Heat and Mass Transfer, 150, 119280. https://doi.org/10.1016/j.ijheatmasstransfer.2019.119280
• Ludick L., Craig K. J., Valluri P., & Meyer J. P. 2023. Influence of pin-fin patterns and geometry on the effectiveness of jet impingement boiling–A computational study. Applied Thermal Engineering, 229, 120626. https://doi.org/10.1016/j.applthermaleng.2023.120626
• Nakamura T. and Hishinuma M., 2000, Critical heat flux enhancement in microchannel heat sinks, International Journal of Heat and Mass Transfer, 43(20), 3745-3754.
• Patel R. and Joshi R., 2021, Development of correlations for micro pin fin heat sinks in laminar and turbulent flows, Applied Thermal Engineering, 185, 116319.
• Pavithra, J., Kumar, T. P., Raju, N. V., & Sridhara, S. N. (2025). Nanoparticle shape effect on heat transfer in nanofluid flow past a stretching sheet with exponential heat source/sink: a statistical approach. Journal of Thermal Analysis and Calorimetry, 150(16), 12801-12818. https://doi.org/10.1007/s10973-025-14493-1
• Pérez L. M. and Álvarez M. M., 2022, Overheating issues and cooling solutions for modern electronics, Applied Thermal Engineering, 206, 118064.
• Singh P. and Kumar V., 2021, Secondary flow and vortex effects in micro pin fin heat sinks, Experimental Thermal and Fluid Science, 121, 110172.
• Raza W., Ansari D., Jeong J. H., Samad A., & Duwig C. 2024, A Novel Microchannel-Twisted Pinfin Hybrid Heat Sink for Hotspot Mitigation, Applied Thermal Engineering, 241, 122454. https://doi.org/10.1016/j.applthermaleng.2024.122454
• Smith J. and Lee D., 2019, Turbulence effects on heat transfer in micro-structured pin fins, Applied Thermal Engineering, 154, 377-385.
• Wang D. and Fan C., 2022, Design evolution of micro pin fin heat sinks for enhanced heat transfer, Materials Today Communications, 29, 103189.
• Zhang P. and Wu Y., 2023, Next-generation micro pin fin designs for high-density electronic cooling, Journal of Microelectromechanical Systems, 32, 365-377.
• Zhang X. and Chen L., 2022, Enhancing thermal performance of micro pin fins using NACA airfoil profiles: Numerical insights, International Journal of Heat and Fluid Flow, 94, 108808.
• Zhang S. and Luo Y., 2019, Vortex dynamics and heat transfer enhancement in micro pin fin arrays, Applied Thermal Engineering, 159, 113927.
• Zunaid, M., Mustafa, M. G., Husain, A., Bharti, H. R., & Sardar, A. 2025, Mathematical analysis of heat transfer in inclined micro-jet impingement heat sink. In 22nd International conference on Recent Advances in Mechanical Engineering for Sustainable Development, ISME 2024 (pp. 48-59). Association of American Publishers. https://doi.or/10.21741/9781644903438