Investigation on Thermoelectric Device Performance by modeling and simulations

Year 2025, Volume: 2 Issue: 2, 40 - 48, 22.01.2026

G. Udhaya Sankar , C. Ganesa Moorthy

Abstract

This study investigates performance of thermoelectric devices, specifically thermoelectric legs (TML), by using COMSOL Multiphysics simulations. The objective is to analyze efficiency of Cu2Bi2Te3 composite material in TML devices, particularly when coupled with copper based thermocouples. The research leverages finite element analysis (FEA) to model heat and electric energies transfer within the thermoelectric system, by considering whole surface temperature, electric potential, and iso-surface temperature. Simulation results indicate that performance of Cu2Bi2Te3 in both mm and nm scales as e-numbered element can be evaluated through the electric conductivity, thermal conductivity, and Seebeck values. The study explores impacts of composite material properties on thermoelectric device efficiency, and highlights key challenges related to copper thermocouple integration and the complex behaviour of Cu2Bi2Te3 composite materials. This approach provides valuable insights for design of more efficient thermoelectric devices and addresses common issues encountered in experimental performance analysis

Keywords

COMSOL Multiphysics Simulation , Thermoelectric Device , Finite Element Analysis

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