Corrosion-resistant hybrid coatings for copper surfaces substrates by sol-gel chemistry

Abstract

Corrosion is the degradation of a metal, which is caused by chemical reactions between the metal and its surroundings. It poses severe and inevitable problems to the long-term use of particularly copper-based materials in daily life due to the requirement of periodically replacement of it and the loss of its appearance. Therefore, it is necessary to apply a protective layer on them to extend the life span. In this study, inorganic-organic hybrid coatings comprising thiol functional silanes on copper sheets were obtained by spraying onto it followed by curing at elevated temperature. All coatings studied were optically transparent, smooth and crack-free. As they showed excellent adhesion to the copper surface, they were resistant to UV radiation and solutions of acidic and basic conditions. By the coating of copper sheets with hybrid coatings studied, both their mechanical durability and corrosion resistance in the salt spray test were considerably improved.

Keywords

• sol-gel,hybrid coating,transparent thin film,corrosion-resistant materials

References

1. 1. Fan Y, Li C, Chen Z, Chen H. Study on fabrication of the superhydrophobic sol–gel films based on copper wafer and its anti-corrosive properties. Appl Surf Sci. 2012 2012/06/15/;258(17):6531-6.
2. 2. Muñoz AI, Antón JG, Guiñón JL, Herranz VP. Comparison of inorganic inhibitors of copper, nickel and copper–nickels in aqueous lithium bromide solution. Electrochimica Acta. 2004 2004/12/15/;50(4):957-66.
3. 3. Antonijevic MM, Petrovic MB. Copper corrosion inhibitors. A review. Int J Electrochem Sci. 2008 Jan;3(1):1-28. PubMed PMID: WOS:000256383600001. English.
4. 4. Sherif EM, Park S-M. 2-Amino-5-ethyl-1,3,4-thiadiazole as a corrosion inhibitor for copper in 3.0% NaCl solutions. Corrosion Science. 2006 2006/12/01/;48(12):4065-79.
5. 5. Sherif EM, Park S-M. Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole on copper corrosion as a corrosion inhibitor in aerated acidic pickling solutions. Electrochimica Acta. 2006 2006/09/15/;51(28):6556-62.
6. 6. Sherif E-SM. Effects of 2-amino-5-(ethylthio)-1,3,4-thiadiazole on copper corrosion as a corrosion inhibitor in 3% NaCl solutions. Appl Surf Sci. 2006 2006/10/15/;252(24):8615-23.
7. 7. Stupnis̆ek-Lisac E, Brnada A, Mance AD. Secondary amines as copper corrosion inhibitors in acid media. Corrosion Science. 2000 2000/02/01/;42(2):243-57.
8. 8. Ma H, Chen S, Niu L, Zhao S, Li S, Li D. Inhibition of copper corrosion by several Schiff bases in aerated halide solutions. Journal of Applied Electrochemistry. 2002 January 01;32(1):65-72.

9. 9. Ehteshamzade M, Shahrabi T, Hosseini MG. Inhibition of copper corrosion by self-assembled films of new Schiff bases and their modification with alkanethiols in aqueous medium. Appl Surf Sci. 2006 2006/02/15/;252(8):2949-59.
10. 10. Matos JB, Pereira LP, Agostinho SML, Barcia OE, Cordeiro GGO, D'Elia E. Effect of cysteine on the anodic dissolution of copper in sulfuric acid medium. Journal of Electroanalytical Chemistry. 2004 2004/08/15/;570(1):91-4.
11. 11. Moretti G, Guidi F. Tryptophan as copper corrosion inhibitor in 0.5 M aerated sulfuric acid. Corrosion Science. 2002 2002/09/01/;44(9):1995-2011.
12. 12. Gasparac R, Martin CR, Stupnisek-Lisac E. In situ studies of imidazole and its derivatives as copper corrosion inhibitors - I. Activation energies and thermodynamics of adsorption. J Electrochem Soc. 2000 Feb;147(2):548-51. PubMed PMID: WOS:000085294400023. English.
13. 13. Bastidas JM, Lopez-Delgado A, Cano E, Polo JL, Lopez FA. Copper corrosion mechanism in the presence of formic acid vapor for short exposure times. J Electrochem Soc. 2000 Mar;147(3):999-1005. PubMed PMID: WOS:000085912700028. English.
14. 14. Papapanayiotou D, Nuzzo RN, Alkire RC. Adsorption of thiourea on copper electrodes monitored by in situ infrared spectroscopy. J Electrochem Soc. 1998 Oct;145(10):3366-73. PubMed PMID: WOS:000076217000009. English.
15. 15. Feng YQ, Teo WK, Siow KS, Gao ZQ, Tan KL, Hsieh AK. Corrosion protection of copper by a self-assembled monolayer of alkanethiol. J Electrochem Soc. 1997 Jan;144(1):55-64. PubMed PMID: WOS:A1997WG07000014. English.
16. 16. Quartarone G, Moretti G, Bellomi T, Capobianco G, Zingales A. Using indole to inhibit copper corrosion in aerated 0.5 M sulfuric acid. Corrosion. 1998 Aug;54(8):606-18. PubMed PMID: WOS:000075196800004. English.
17. 17. Stein N, Johann L, Rapin C, Lecuire JM. In-situ ellipsometric study of copper passivation by copper heptanoate through electrochemical oxidation. Electrochimica Acta. 1998 1998/07/01/;43(21):3227-34.
18. 18. Sui W, Zhao W, Zhang X, Peng S, Zeng Z, Xue Q. Comparative anti-corrosion properties of alkylthiols SAMs and mercapto functional silica sol–gel coatings on copper surface in sodium chloride solution. Journal of Sol-Gel Science and Technology. 2016 November 01;80(2):567-78.
19. 19. Biswas BN, Mollah MYA, Susan MABH. Potentiodynamic studies on corrosion of copper by chloride ions and its inhibition by inorganic and organic ions in aqueous buffer solution. Ionics. 2012 January 01;18(1):189-95.
20. 20. Liang C, Wang P, Wu B, Huang N. Inhibition of copper corrosion by self-assembled monolayers of triazole derivative in chloride-containing solution. Journal of Solid State Electrochemistry. 2010 August 01;14(8):1391-9.
21. 21. Figueira R, Fontinha I, Silva C, Pereira E. Hybrid Sol-Gel Coatings: Smart and Green Materials for Corrosion Mitigation. Coatings. 2016;6(1):12. PubMed PMID: doi:10.3390/coatings6010012.
22. 22. Budakoglu R, Arpac E. Synthesis of inorganic-organic polymers. In: Mandal H, Ovecoglu L, editors. Euro Ceramics Viii, Pts 1-3. Key Engineering Materials. 264-268. Zurich-Uetikon: Trans Tech Publications Ltd; 2004. p. 423-6.
23. 23. Tatar P, Kiraz N, Asiltürk M, Sayılkan F, Sayılkan H, Arpaç E. Antibacterial Thin Films on Glass Substrate by Sol–Gel Process. Journal of Inorganic and Organometallic Polymers and Materials. 2007 September 01;17(3):525-33.
24. 24. New Test Method for Optical Imaging Evaluation of Adhesion by Tape Test Specimens, ASTM D 3359 WK97
25. 25. Caprioli F, Martinelli A, Gazzoli D, Di Castro V, Decker F. Enhanced Protective Properties and Structural Order of Self-Assembled Monolayers of Aromatic Thiols on Copper in Contact with Acidic Aqueous Solution. The Journal of Physical Chemistry C. 2012 2012/02/23;116(7):4628-36.