High Level Architecture (HLA) is a software architecture that ensures more than one simulation applications to run on a distributed environment as if they are a single simulation. This architecture, which has already been standardized (IEEE 1516), is obligatory for the implementations of the simulations developed by the US Department of Defense for the defense applications of the USA. It is also obligatory in Turkey for most of the defense-purposed simulations to be compatible with this standard. Usage of High Level Architecture in civil applications becomes widespread as well. The scientific simulation applications, which require high performance computing capacity, are good candidates to be realized with High Level Architecture. Within the scope of this study, the common weather and climate simulation has been investigated, and it has been determined what would the benefits and obstacles be when this simulation is implemented with High Level Architecture.
Yüksek Düzeyli Mimari (HLA-High Level Architecture), birden fazla benzetim uygulamasynyn da?ytylmy? bir ortamda tek bir benzetim uygulamasy gibi çaly?masyny sa?layan bir yazylym mimarisidir. Standartla?my? (IEEE 1516) olan bu mimari, Amerikan Savunma Bakanly?y tarafyndan Amerika Birle?ik Devletleri için geli?tirilen savunma amaçly benzetim uygulamalarynyn gerçekle?tirilmesinde zorunlu tutulmaktadyr. Türkiye'de de savunma amaçly geli?tirilecek benzetim uygulamalarynyn birço?unda bu standarda uyumluluk ?art ko?ulmaktadyr. Yüksek Düzeyli Mimarinin sivil uygulamalarda da kullanymy yaygynla?maktadyr. Yüksek ba?arymly i?lem sy?asyna gereksinim duyan bilimsel benzetim uygulamalary da Yüksek Düzeyli Mimariyle gerçekle?tirilmek için iyi birer aday olarak gözükmektedir. Bu çaly?ma kapsamynda hava tahmin benzetimi incelenmi? ve bu benzetimin Yüksek Düzeyli Mimari ile gerçekle?tirilmek istenildi?inde elde edilebilecek yararlaryn ve önümüze çykabilecek engellerin neler olabilece?i belirlenmi?tir.
Primary Language | Turkish |
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Journal Section | Computer Engineering |
Authors | |
Publication Date | February 1, 2011 |
Published in Issue | Year 2011 Volume: 6 Issue: 1 |