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T/M YÖNTEMİYLE ÜRETİLMİŞ Ni-Ti-Cu KOMPOZİTLERİNİN DİFÜZYON KAYNAĞINDA SICAKLIK, SÜRE VE ARATABAKANIN BİNDİRME KAYMA TEST DEĞERLERİNE ETKİSİNİN İSTATİSTİĞE GÖRE İNCELENMESİ

Year 2009, Volume: 4 Issue: 2, 109 - 119, 01.03.2009

Abstract

Bu çalışmada, toz metalurjisi yöntemiyle üretilmiş Ni-Ti-Cu kompozitlerinin difüzyon kaynağında sıcaklık, süre ve aratabaka değerlerinin bindirme-kayma değerlerine etkisi istatistiki olarak araştırıldı. Ni-Ti-Cu kompoziti ortalama 45±5µm Ni-Ti ve 37–105±5 µm Cu tozlarından üretildi. Difüzyon kaynakları argon koruyucu gaz atmosferinde, 5 MPa'lık dinamik yükleme ile 40 ve 60 dk.'lık sürelerde ve 910-940 ve 970ºC'lik sıcaklıklarda Ni ve Cu aratabaka kullanılarak yapıldı. Deneyler sonucunda mikroyapı özellikleri optik mikroskop, SEM-EDS ve X-Ray analizleri ile incelendi. Numunelerin birleşme mukavemetini incelemek için bindirme-kayma testleri yapıldı. Test sonuçları, Çok Değişkenli İki Yönlü Varyans Analizi (MANOVA) yöntemi ile değerlendirildi. Sonuç olarak, sıcaklık, süre ve aratabaka değerleri ile bindirme-kayma değerlendirmeleri arasında %85 oranında anlamlı bir farklılığın olduğu tespit edilmiştir. Bu farklılık Ni ve Cu aratabaka kullanımının bindirme-kayma açısından anlamlılığını ifade etmektedir.

THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS

Year 2009, Volume: 4 Issue: 2, 109 - 119, 01.03.2009

Abstract

In this study, statistical values of lap-shear test were investigated in terms of temperature, duration and interlayer on the diffusion bonding of Ni-Ti-Cu composite manufactured by powder metallurgy method. Ni-Ti-Cu composite was manufactured with proportions by mixing 45±5µm Ni-Ti and 37–105±5 µm Cu powders. Diffusion bonding experiments have been carried out in argon atmosphere at the temperatures 910-940 and 970ºC and 5 MPa under a dynamic load for at 40 and 60 minute holding times used Ni and Cu interlayer. Microstructure examinations at bond interface were investigated by optical microscopy, SEM-EDS and X-Ray analysis. The lap-shear test values of the bonded samples were tested by lap-shear tests. The test results were analyzed by Multivariate Analysis of Variance (MANOVA) with a confidence level of 85% to find out whether a statistically significant difference occurs. Temperature, duration and interlayer on the diffusion bonding of Ni-Ti-Cu composites were statistically significant in lap-shear test values.

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Details

Primary Language Turkish
Journal Section Electrical Machines
Authors

Haluk Kejanlı

Uğur Çalıgülü

Mustafa Taşkın

Emrah Hanifi Fırat

Publication Date March 1, 2009
Published in Issue Year 2009 Volume: 4 Issue: 2

Cite

APA Kejanlı, H., Çalıgülü, U., Taşkın, M., Fırat, E. H. (2009). THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS. Technological Applied Sciences, 4(2), 109-119. https://doi.org/10.12739/10.12739
AMA Kejanlı H, Çalıgülü U, Taşkın M, Fırat EH. THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS. Technological Applied Sciences. March 2009;4(2):109-119. doi:10.12739/10.12739
Chicago Kejanlı, Haluk, Uğur Çalıgülü, Mustafa Taşkın, and Emrah Hanifi Fırat. “THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS”. Technological Applied Sciences 4, no. 2 (March 2009): 109-19. https://doi.org/10.12739/10.12739.
EndNote Kejanlı H, Çalıgülü U, Taşkın M, Fırat EH (March 1, 2009) THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS. Technological Applied Sciences 4 2 109–119.
IEEE H. Kejanlı, U. Çalıgülü, M. Taşkın, and E. H. Fırat, “THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS”, Technological Applied Sciences, vol. 4, no. 2, pp. 109–119, 2009, doi: 10.12739/10.12739.
ISNAD Kejanlı, Haluk et al. “THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS”. Technological Applied Sciences 4/2 (March 2009), 109-119. https://doi.org/10.12739/10.12739.
JAMA Kejanlı H, Çalıgülü U, Taşkın M, Fırat EH. THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS. Technological Applied Sciences. 2009;4:109–119.
MLA Kejanlı, Haluk et al. “THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS”. Technological Applied Sciences, vol. 4, no. 2, 2009, pp. 109-1, doi:10.12739/10.12739.
Vancouver Kejanlı H, Çalıgülü U, Taşkın M, Fırat EH. THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS. Technological Applied Sciences. 2009;4(2):109-1.