Thermoelectric Properties of Bismuth Telluride Filled Silicone

Volume: 1 Number: 6 June 1, 2015
  • Bruce Y. Decker
  • Sinclair Calderon
  • Yong Gan
EN TR

Thermoelectric Properties of Bismuth Telluride Filled Silicone

Abstract

Bismuth telluride filled silicone rubber composite was extruded into millimeter-sized wires using electrospinning. The composite wires were tested in view of the electrical resistance and Seebeck coefficient. The highest electrical resistance measured is 2.9*1010 ohms. The composite material exhibited high Seebeck effect because silicone rubber exhibits low thermal conductivity as a result of increased phonon scatters. Moreover, compared with the bulk reference material, the thermoelectric property of bismuth telluride is notably enhanced. Due to the inherent flexibility of silicone rubber and thermoelectric property of bismuth telluride, it is possible for making a flexible thermoelectric material for alternative energy applications

Keywords

References

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Details

Primary Language

English

Subjects

-

Journal Section

-

Authors

Bruce Y. Decker This is me

Sinclair Calderon This is me

Yong Gan This is me

Publication Date

June 1, 2015

Submission Date

May 14, 2015

Acceptance Date

-

Published in Issue

Year 2015 Volume: 1 Number: 6

APA
Decker, B. Y., Calderon, S., & Gan, Y. (2015). Thermoelectric Properties of Bismuth Telluride Filled Silicone. Journal of Thermal Engineering, 1(6), 402-407. https://doi.org/10.18186/jte.19724
AMA
1.Decker BY, Calderon S, Gan Y. Thermoelectric Properties of Bismuth Telluride Filled Silicone. Journal of Thermal Engineering. 2015;1(6):402-407. doi:10.18186/jte.19724
Chicago
Decker, Bruce Y., Sinclair Calderon, and Yong Gan. 2015. “Thermoelectric Properties of Bismuth Telluride Filled Silicone”. Journal of Thermal Engineering 1 (6): 402-7. https://doi.org/10.18186/jte.19724.
EndNote
Decker BY, Calderon S, Gan Y (June 1, 2015) Thermoelectric Properties of Bismuth Telluride Filled Silicone. Journal of Thermal Engineering 1 6 402–407.
IEEE
[1]B. Y. Decker, S. Calderon, and Y. Gan, “Thermoelectric Properties of Bismuth Telluride Filled Silicone”, Journal of Thermal Engineering, vol. 1, no. 6, pp. 402–407, June 2015, doi: 10.18186/jte.19724.
ISNAD
Decker, Bruce Y. - Calderon, Sinclair - Gan, Yong. “Thermoelectric Properties of Bismuth Telluride Filled Silicone”. Journal of Thermal Engineering 1/6 (June 1, 2015): 402-407. https://doi.org/10.18186/jte.19724.
JAMA
1.Decker BY, Calderon S, Gan Y. Thermoelectric Properties of Bismuth Telluride Filled Silicone. Journal of Thermal Engineering. 2015;1:402–407.
MLA
Decker, Bruce Y., et al. “Thermoelectric Properties of Bismuth Telluride Filled Silicone”. Journal of Thermal Engineering, vol. 1, no. 6, June 2015, pp. 402-7, doi:10.18186/jte.19724.
Vancouver
1.Bruce Y. Decker, Sinclair Calderon, Yong Gan. Thermoelectric Properties of Bismuth Telluride Filled Silicone. Journal of Thermal Engineering. 2015 Jun. 1;1(6):402-7. doi:10.18186/jte.19724

Cited By

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