Research Article

USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS

Volume: 4 Number: 2 December 20, 2017
EN

USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS

Abstract

Effective cooling of electronic components plays an important role in system design and efficiency. In this study, the effects of using the flow routing plate in cooling printed circuit boards have been investigated. For this purpose, effects of the flow routing plate on the laminar mixed convection heat transfer from protruded heat sources at the side walls of the horizontal channel, were investigated numerically. The air was used as cooling fluid, and protruded heat sources were equipped as rows into the rectangular channel with insulated walls. Numerical investigations were carried out for different plate inclination angles at different Reynolds and modified Grashof numbers. It is observed that the using of flow routing plate increases the heat transfer at different ratios by comparison to the case without plate and enhances the cooling conditions for all values of parameters in the analyses. The highest heat transfer enhancement occurred at values where Reynolds number (Re) was Re = 1000 and plate inclination angle (α) was α = 60 °.The results obtained during the numerical analyses are presented in detail in the form of graphics for the row averaged Nusselt number, heater temperatures, velocity vectors, and temperature contours.

Keywords

References

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Details

Primary Language

English

Subjects

-

Journal Section

Research Article

Publication Date

December 20, 2017

Submission Date

February 24, 2017

Acceptance Date

April 22, 2017

Published in Issue

Year 2018 Volume: 4 Number: 2

APA
Kurşun, B. (2017). USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS. Journal of Thermal Engineering, 4(2), 1791-1802. https://doi.org/10.18186/journal-of-thermal-engineering.382393
AMA
1.Kurşun B. USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS. Journal of Thermal Engineering. 2017;4(2):1791-1802. doi:10.18186/journal-of-thermal-engineering.382393
Chicago
Kurşun, Burak. 2017. “USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS”. Journal of Thermal Engineering 4 (2): 1791-1802. https://doi.org/10.18186/journal-of-thermal-engineering.382393.
EndNote
Kurşun B (December 1, 2017) USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS. Journal of Thermal Engineering 4 2 1791–1802.
IEEE
[1]B. Kurşun, “USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS”, Journal of Thermal Engineering, vol. 4, no. 2, pp. 1791–1802, Dec. 2017, doi: 10.18186/journal-of-thermal-engineering.382393.
ISNAD
Kurşun, Burak. “USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS”. Journal of Thermal Engineering 4/2 (December 1, 2017): 1791-1802. https://doi.org/10.18186/journal-of-thermal-engineering.382393.
JAMA
1.Kurşun B. USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS. Journal of Thermal Engineering. 2017;4:1791–1802.
MLA
Kurşun, Burak. “USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS”. Journal of Thermal Engineering, vol. 4, no. 2, Dec. 2017, pp. 1791-02, doi:10.18186/journal-of-thermal-engineering.382393.
Vancouver
1.Burak Kurşun. USING OF FLOW ROUTING PLATE FOR COOLING OF PRINTED CIRCUIT BOARDS. Journal of Thermal Engineering. 2017 Dec. 1;4(2):1791-802. doi:10.18186/journal-of-thermal-engineering.382393

Cited By

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