A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX
Abstract
Keywords
References
- [1] Jha, Chandra Mohan. Thermal Sensors_Principles and Applications for Semiconductor Industries. Principles of Chemical Sensors, 2009. https://doi.org/10.1007/b136378_3.
- [2] Künzi, R. Thermal Design of Power Electronic Circuits. In CERN Accelerator School: Power Converters, CAS 2014 - Proceedings, 2018;311-327. https://doi.org/10.5170/CERN-2015-003.311.
- [3] Miller, T.J.E. Power Electronics Devices, Drivers and Applications. Electronics and Power, 1987. https://doi.org/10.1049/ep.1987.0287.
- [4] Al-Tae'y, K. A. , Eqbal H.A. and Jebur M. N. Experimental investigation of water cooled minichannel heat sink for computer processing unit cooling, Int. Journal of Engineering Research and Application, 2017; 38-49. https:// doi.org/10.9790/9622-0708013849
- [5] Mallik, Sabuj, and Franziska Kaiser. Reliability Study of Subsea Electronic Systems Subjected to Accelerated Thermal Cycle Ageing. In Lecture Notes in Engineering and Computer Science, 2014. https://gala.gre.ac.uk/id/eprint/12319/.
- [6] Yeo, Jiwon, Seiya Yamashita, Mizuki Hayashida, and Shigeru Koyama. A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 2014;128-137. https://doi.org/10.4236/jectc.2014.44014.
- [7] Ghobadi, Mehdi, and Yuri S. Muzychka. Heat Transfer and Pressure Drop in Mini Channel Heat Sinks. Heat Transfer Engineering, 2015;902-911. https://doi.org/10.1080/01457632.2015.965097.
- [8] Hetsroni, G., A. Mosyak, and Z. Segal. Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels. IEEE Transactions on Components and Packaging Technologies, 2001;16-23. https://doi.org/10.1109/6144.910797.
Details
Primary Language
English
Subjects
Engineering
Journal Section
Note
Authors
Kays A. Al-tae’y
This is me
0000-0003-0433-4465
Iraq
Ameer Abed Jaddoa
*
This is me
0000-0001-5158-1827
Iraq
Hussain Saad Abd
This is me
0000-0002-9341-4119
Iraq
Publication Date
May 1, 2021
Submission Date
July 9, 2019
Acceptance Date
September 29, 2019
Published in Issue
Year 2021 Volume: 7 Number: 4