Thermal resistance can be
increased by using proper heat insulation materials. Traditional heat
insulation materials do not stand all desired properties. Thus, developing new
heat insulation materials is very important. In this study, expanded perlite
based heat insulation material was developed as an alternative to the
traditional insulation materials. The composition of the developed material was
designed and prepared using the theoretical thermal conductivity prediction
models. The prepared material was molded in a rectangular shape panel. Thermal
conductivities of panels were measured experimentally and the results were
compared with the calculated results.
Also, the results showed that the developed panels can be used for heat
insulation applications. On the other hand, the closest model to the
experimental results is the parallel model whose average deviation is 4.22%
while the farthest model is the Cheng and Vachon model whose average deviation
is 12.43%. It is obtained that parallel and series models are generally in good
agreement with the experimental results. Nevertheless, it is seen some
deviations between experimental and theoretical calculation results. The theoretical prediction models do not
include any processing conditions such as molding and curing. It is thought
that these deviations have originated because of the missing processing
parameters in theoretical prediction models. As a result of experimental
studies, the lowest thermal conductivity value of expanded perlite based panels
was obtained 43.5 mW/m.K. Consequently, the heat transfer coefficient of the
panels containing expanded perlite can be calculated nearly by the parallel
method.
Primary Language | English |
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Journal Section | Articles |
Authors | |
Publication Date | June 25, 2018 |
Submission Date | March 2, 2017 |
Published in Issue | Year 2018 Volume: 4 Issue: 5 |
IMPORTANT NOTE: JOURNAL SUBMISSION LINK http://eds.yildiz.edu.tr/journal-of-thermal-engineering