Bactericidal and antibiofilm activities of copper against biofilm producer pathogens colonized on orthopedic implants
Abstract
Background: New and alternative antimicrobial and antibiofilm agent discovery has gained attention since antibiotic resistance was easily developed. It has been accepted that metals have antimicrobial activity. Abiotic surfaces such as orthopedic implants that are impregnated with copper can prevent colonization of biofilm producer pathogens, and can detach biofilms produced on implants. In this study, the effects of copper against planktonic bacteria and biofilm embedded bacteria adhered on kirschner wire orthopedic implant were studied.
Material and Methods: MICs, MBCs and MBEC of copper against main biofilm producer pathogens such as methicillin resistance Staphylococcus aureus (MRSA), methicillin sensitive Staphylococcus aureus (MSSA), methicillin resistance Staphylococcus epidermidis (MRSE), methicillin sensitive Staphylococcus epidermidis (MSSE), Escherichia coli (E. coli), Klebsiella pneumoniae (K. pneumoniae), Pseudomonas aeruginosa (P. aeruginosa), Proteus mirabilis (P. mirabilis) colonized on kirschner wire orthopedic implant were determined.
Results: MICs, MBCs, and MBECs of copper against pathogens were ranged from 0.063 to 0.75 mg/mL. This study revealed that 0.75 mg/mL of copper inhibit all isolates analyzed in this study. The most tolerant pathogen was MRSA. The activities of copper against biofilm embedded bacteria and planktonic bacteria were found to be the same.
Conclusion: Indwelling medical devices such as orthopedic wires, prosthetics can be impregnated by copper to overcome colonization and production of matured biofilm on indwelling devices, consequently, implant associated infections.
Keywords
References
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Details
Primary Language
English
Subjects
Health Care Administration
Journal Section
Research Article
Authors
Sahra Kırmusaoğlu
HALİÇ ÜNİVERSİTESİ
Türkiye
Publication Date
March 1, 2018
Submission Date
March 24, 2017
Acceptance Date
April 11, 2017
Published in Issue
Year 2018 Volume: 9 Number: 1