Research Article
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Year 2019, Volume: 2 Issue: 1, 57 - 77, 30.06.2019

Abstract

References

  • 1. Lee, H. and K. Neville, Epoxy Resins: Their Applications and Technology. First Edition ed. 1957.
  • 2. F.Y.C Boey. B.H Yap; Microwave curing of an epoxy –amine system; effect of curing agent on the glass-transition temperature. Polymer Testing 20 (2001) 837 –845
  • 3. J. Wei, M.C Hawley; Kinetics Modelling and Time-Temperature- Transformation Diagram of Microwave and Thermal Cure of Epoxy Resins. Polymer Engineering and Science 1995 vol 35 461 –470.
  • 4. Thostenson, E.T. and T.W. Chou, Microwave processing: fundamentals and applications. Composites Part A: Applied Science and Manufacturing, 1999. 30(9): p. 1055-1071.
  • 5. Carrozzino, S., et al., Calorimetric and microwave dielectric monitoring of epoxy resin cure. Polymer Engineering & Science, 1990. 30(6): p. 366-373
  • 6. Baden Fuller, A.J., Microwaves: An Introduction to Microwave Theory and Techniques. Third Edition ed. 1990.
  • 7. May, C.A., Epoxy Resins: Chemistry And Technology. 1987: CRc Press.
  • 8. Silverstein, R.M., G. Clayton Bassler, and T.C. Morrill, Spectrometric Identification Of Organic Compounds. Fifth ed. 1991.
  • 9. E. Samoladis; Effect of microwave curing upon the interfacial properties of model carbon /epoxy composites. MSc Dissertation.
  • 10. Koenig, J.L., Spectroscopy of polymers. 1999: Elsevier Science Ltd.
  • 11. ErtugrulCubukcu; Optical Spectroscopy of semiconducting solids
  • 12. Young, R.J. and P.A. Lovell, Introduction to polymers. 1991: CRC.
  • 13. J. Wei, Martin C Hawley and John D Delong; Comparason of Microwave and Thermal cure of Epoxy Resins. Polymer Engineering and Sceince 1993 vol 33 1132 – 1140.

RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING

Year 2019, Volume: 2 Issue: 1, 57 - 77, 30.06.2019

Abstract

This
research was carried out in order to further understand the effects of
microwave heating on the functional groups and curing of epoxy systems. Raman
Spectroscopy was used to record the stokes and the antistokes spectra of
Diglydicydyl Ether of Bisphenol A (DGEBA) and 4,4’ Diphenyldiaminosulfone (DDS)
epoxy system at different temperatures during conventional and microwave cure,
and their molecular temperatures were calculated from the data obtained. The
temperatures showed that thermal heating does not excite the functional groups
of the epoxy resin and the hardener, as their molecular temperature was in the
same region as the cure temperature whereas Raman spectroscopy was unable to
produce any stokes or antistokes spectra during microwave curing of the epoxy
system. The cure kinetics of the DLS 772 / 4, 4’ DDS system was also studied by
using Differential Scanning Calorimetry (DSC) and a Microwave heated
calorimeter. The DSC results showed that microwave curing of the DGEBA / 4, 4’
DDS system began at a higher temperature than thermal curing. Higher rates of
reaction and activation energies were also observed in the microwave cured
samples. The temperature at which fractional conversion began increased with
increase in heating rate during microwave curing, but it was independent from
heating rate during conventional cure. The rates of reaction also increased
with an increase in heating rates for both thermal and microwave cure. These
results suggest that, compared to conventional heating, microwave heating is
more efficient curing technique which leads to more uniform cure and less
internal stresses within the material.

References

  • 1. Lee, H. and K. Neville, Epoxy Resins: Their Applications and Technology. First Edition ed. 1957.
  • 2. F.Y.C Boey. B.H Yap; Microwave curing of an epoxy –amine system; effect of curing agent on the glass-transition temperature. Polymer Testing 20 (2001) 837 –845
  • 3. J. Wei, M.C Hawley; Kinetics Modelling and Time-Temperature- Transformation Diagram of Microwave and Thermal Cure of Epoxy Resins. Polymer Engineering and Science 1995 vol 35 461 –470.
  • 4. Thostenson, E.T. and T.W. Chou, Microwave processing: fundamentals and applications. Composites Part A: Applied Science and Manufacturing, 1999. 30(9): p. 1055-1071.
  • 5. Carrozzino, S., et al., Calorimetric and microwave dielectric monitoring of epoxy resin cure. Polymer Engineering & Science, 1990. 30(6): p. 366-373
  • 6. Baden Fuller, A.J., Microwaves: An Introduction to Microwave Theory and Techniques. Third Edition ed. 1990.
  • 7. May, C.A., Epoxy Resins: Chemistry And Technology. 1987: CRc Press.
  • 8. Silverstein, R.M., G. Clayton Bassler, and T.C. Morrill, Spectrometric Identification Of Organic Compounds. Fifth ed. 1991.
  • 9. E. Samoladis; Effect of microwave curing upon the interfacial properties of model carbon /epoxy composites. MSc Dissertation.
  • 10. Koenig, J.L., Spectroscopy of polymers. 1999: Elsevier Science Ltd.
  • 11. ErtugrulCubukcu; Optical Spectroscopy of semiconducting solids
  • 12. Young, R.J. and P.A. Lovell, Introduction to polymers. 1991: CRC.
  • 13. J. Wei, Martin C Hawley and John D Delong; Comparason of Microwave and Thermal cure of Epoxy Resins. Polymer Engineering and Sceince 1993 vol 33 1132 – 1140.
There are 13 citations in total.

Details

Primary Language English
Journal Section Articles
Authors

Babatunde Bolasodun 0000-0002-2720-5933

Ademola Agbeleye This is me

Richard Day This is me

Publication Date June 30, 2019
Submission Date January 3, 2019
Acceptance Date May 28, 2019
Published in Issue Year 2019 Volume: 2 Issue: 1

Cite

APA Bolasodun, B., Agbeleye, A., & Day, R. (2019). RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING. Usak University Journal of Engineering Sciences, 2(1), 57-77.
AMA Bolasodun B, Agbeleye A, Day R. RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING. UUJES. June 2019;2(1):57-77.
Chicago Bolasodun, Babatunde, Ademola Agbeleye, and Richard Day. “RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING”. Usak University Journal of Engineering Sciences 2, no. 1 (June 2019): 57-77.
EndNote Bolasodun B, Agbeleye A, Day R (June 1, 2019) RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING. Usak University Journal of Engineering Sciences 2 1 57–77.
IEEE B. Bolasodun, A. Agbeleye, and R. Day, “RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING”, UUJES, vol. 2, no. 1, pp. 57–77, 2019.
ISNAD Bolasodun, Babatunde et al. “RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING”. Usak University Journal of Engineering Sciences 2/1 (June 2019), 57-77.
JAMA Bolasodun B, Agbeleye A, Day R. RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING. UUJES. 2019;2:57–77.
MLA Bolasodun, Babatunde et al. “RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING”. Usak University Journal of Engineering Sciences, vol. 2, no. 1, 2019, pp. 57-77.
Vancouver Bolasodun B, Agbeleye A, Day R. RAMAN SPECTROSCOPY AND CURE KINETICS STUDIES OF A DLS 772 AND 4 4’DDS EPOXY SYSTEM DURING THERMAL AND MICROWAVE CURING. UUJES. 2019;2(1):57-7.

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