Because of the fabrication techniques, mechanical properties of the materials
used in micro electromechanical systems should be determined by utilizing micro-scale test
structures. In this study, a micro bending test structure, whose actuator, sample, and readout
scale are integrally fabricated on a single chip is presented. Integrated fabrication of all
components eliminates the alignment problem observed in similar systems. The structure
relies on the principle of bending a double-clamped beam from its center by using an
electrostatic comb drive. Deflection amount is determined by using image processing
techniques on the read-out scale. Designed structures are fabricated by using silicon-oninsulator
wafers. As a result of the tests, elastic modulus of silicon is determined as 136
GPa in accordance with the literature.
Micro electromechanical systems material characterization electrostatic actuator
Konular | Mühendislik |
---|---|
Bölüm | Makaleler |
Yazarlar | |
Yayımlanma Tarihi | 1 Şubat 2012 |
Yayımlandığı Sayı | Yıl 2012 Cilt: 9 Sayı: 1 |