Kaplamalı Terminal Blok Ucunda Tasarımsal Değişim Yapılarak Mekanik Özelliklerinin Araştırılması

Yıl 2022, Cilt: 8 Sayı: 1, 103 - 109, 30.04.2022

Mert Onan Ahmet Celal Topkaya Eyyüp Öksüztepe

Öz

Otomotiv ve beyaz eşya sektöründe kullanılan bakır alaşımlarının iletkenlikleri yüksek olmasından dolayı terminal olarak tercih edilmektedir. Bakır alaşımlarının düşük kontak direnci, yüksek mekanik dayanım için uygun tasarım seçimi önemli hale gelmektedir. Bakır alaşımın kaplanması neticesinde iletken terminalin akım geçiş seviyesi ve yüzeyde korozyondan koruyan film oluşumu geliştirilmektedir. Bu çalışma da amaç CuNiSiP malzemeden imal edilecek PCB terminallerinin kontak kuvvetlerine göre optimize etmek ve altın kaplamalı olarak üretmektir. Yapılan Sonlu Elemanlar Analizleri ile farklı kontak çapı ve ağız boşluğu parametrelerine göre kontak kuvvetleri hesaplanmıştır. Tasarım sonrası ürün kontak noktalarında yüzey pürüzlülüğünün düşük olduğu ölçülmüştür. Kesme bölgesindeki yüzey pürüzlülük verileri devir sayısına bağlı olarak prototip üretim sonrası tekrar kıyaslanmıştır. Terminal ucu hassas bölgesinde Elektron Mikroskobisi ile karakterize edilmiştir. Karakterizasyon sonrası altın kaplanan bölgelerin kaplama kalınlığı min. 0.8 µm X-ray cihazında ölçülmüştür. Üretilen PCB terminalinin kontak kuvvetlerinin gereksinimleri karşıladığı deneysel olarak ispatlanmıştır.

Anahtar Kelimeler

terminal, Sonlu Elemanlar Analizi, Altın Kaplama, Mekanik Özellikler, CuNiSiP

Destekleyen Kurum

Türkiye Bilimsel ve Teknolojik Araştırma Kurumu

Proje Numarası

TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183)

Teşekkür

Bu çalışma, TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183) kapsamında Türkiye Bilimsel ve Teknolojik Araştırma Kurumu (TÜBİTAK) tarafından desteklenmiştir. Test ve analizlerde yardımını esirgemeyen Hatko Teknik Donanımlar Müm. ve Tic. A.Ş. birimlerine teşekkür ederiz.

Investigation of Mechanical Properties on Coated Terminal Tip by Co-design

Öz

Copper alloys used in the automotive and white goods industry are preferred as terminals due to their high conductivity For low contact resistance and high mechanical strength of copper alloys, appropriate design selection becomes important. As a result of the coating of copper alloy, current transition level of the conductive terminal and the formation of a film that protects against corrosion on the surface are improved. The aim is to optimize the PCB terminals to be made of CuNiSiP material according to the contact forces and to produce them as gold-plated. Production is done for the CuNiSiP copper alloy supplied within the developing dimensions. With the FEA, contact forces were calculated according to different contact diameter and oral cavity parameters. The surface roughness was measured from the product contact point after the final design. The surface roughness data in the cutting zone were compared again after the prototype production, depending on the number of cycle period. During prototype production, sensitive area of terminal tip was characterized by Electron Microscopy. After the characterization, coating thickness of gold-plated regions was measured as minumum 0.8 µm by X-ray Analyses. It is experimentally proven that contact forces of PCB terminal meet the requirements.

Anahtar Kelimeler

Terminal, CuNiSiP, Finite Element Analyses, Gold-plated, Mechanical Properties

Proje Numarası

TÜBİTAK TEYDEB 1501 Projesi (Proje No : 3180183)

Kaynakça

• [1] S. Kyeong and M. G. Pecht Ed., Electrical Connectors Design, Manufacture, Test and Selection. United Kingdom: Wiley-IEEE Press, 2021. (Editör)
• [2] F. Ossart, S. Noel, D. Alamarguy, S. Correia and P. Gendre, “Electromechanical modelling of multilayer contacts in electrical connectors,” in Proceeding of the 53rd IEEE Holm Conference on Electrical Contacts, 16-19 Sept. 2007, PA, USA [Online]. Available: IEEE Xplore, http://www.ieee.org. [Accessed: 10 Dec. 2021].
• [3] J. L. Queffelec, N. Ben Jemaa, D. Travers and G. Pethieu, “Materials and contact shape studies for automobile connectors development,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 14, no. 1, pp. 90-94, March 1991. doi: 10.1109/33.76515
• [4] A. Monnier, B. Froidurot, C. Jarrige, R. Meyer and P. Testé, “A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact,” in Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts, 26-28 Sept. 2005, Chicago, USA [Online]. Available: IEEE Xplore, http://www.ieee.org. [Accessed: 01 Dec. 2021].
• [5] R. E. Abdi and N. Benjemaa. “Study of contact resistance for high copper alloys under indentation and insertion forces.” International Journal of Systems Applications, Engineering and Development, Vol. 2, no. 2, pp. 75-82, 2008.
• [6] P. G. Slade Ed., Electrical contacts: Principles and Applications. New York: CRC Press., 1999. (Editör)
• [7] R. Zauter and D. V. Kudashov, “Precipitation hardened high copper alloys for connector pins made of wire,” www.citeseerx.ist.psu.edu, Nov. 29, 2021. [Online-pdf]. Avaible:https://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.601.9158&rep=rep1&type=pdf. [Accessed: Nov. 29, 2021].
• [8] R. E. Abdi, N. Benjemaa and M. A. Beloufa, “Numerical and experimental studies of automotive connector behaviour,” in Proceeding of the 18th IASTED International Conference on Modelling and Simulation, 30 May- 1 June 2007, Montreal, Canada [Online] Available: actapress, http://www.actapress.com. [Accessed: 11 Dec. 2021].
• [9] C. I. Ucenic and C. Ratiu, “Applying finite element method (FEM) for solving a self cleaning filtering battery module prototype – Case study,” in Proceedings of the 2nd IASME/WSEAS Int. Conf. on Energy and Environment, 15-17 May 2007, Portoroz, Slovenia [Online] Available: ACM DL Digital Library, https://dl.acm.org. [Accessed: 11 Dec. 2021].
• [10] R. E. Abdi, N. Benjemaa and M. A. Beloufa, “Behaviour evolution of automotive connectors,” Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering, vol. 222, no. 2, pp. 151-159, Feb. 2008. https://doi.org/10.1243/09544070JAUTO664
• [11] G. Villeneuve, D. Kulkarni, P. Bastnagel and D. Berry, "Dynamic finite element analysis simulation of the terminal crimping process," Electrical Contacts - 1996. Proceedings of the Forty-Second IEEE Holm Conference on Electrical Contacts. Joint with the 18th International Conference on Electrical Contacts, 1996, pp. 156-172, doi: 10.1109/HOLM.1996.557193.
• [12] D. V. Zhmurkin, N. E. Corman, C. D. Copper and R. D. Hilty, "3-Dimensional Numerical Simulation of Open-Barrel Crimping Process," 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, 2008, pp. 178-184, doi: 10.1109/HOLM.2008.ECP.41.
• [13] “Wieland-K76”, wieland.com, Datasheet, Dec 11, 2021. [Online-pdf]. Available: https://www.wieland.com/de/content/download/12513/file/K76_RP_DE.pdf. [Accessed: Dec. 11, 2021].
• [14] R. Holm Ed., Electric contacts Theory and Application, Berlin:Germany: Springer Verlag, 2000. (Editör)
• [15] K. Shimizu, S. Shimada, S. Sawada, Y. Hattori, “Contact Area Analysis by FEM with Plating Layer for Electrical Contact” IEICE Transactions on Electronics, vol. E92.C, no. 8, pp. 1013-1019, August 2009. https://doi.org/10.1587/transele.E92.C.1013
• [16] X. Gong, Y. Feng, Z. W. Ren, J. Cheng, J. R. Tan, “An adaptive design method for understanding tolerance in the precision stamping process” Journal of Zhejiang University-SCIENCE A, vol 16, no 5, pp. 387-394. Doi:10.1631/jzus.A1400220.
• [17] S. Sawada, K. Shimizu, Y. Hattori, T. Tamai and K. Iida, "Analysis of Contact Resistance Behavior for Electric Contacts with Plating Layer," 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, pp. 1-8, doi: 10.1109/HOLM.2010.5619560.
• [18] “SAI Global”, https://infostore.saiglobal.com, Standards On-Line-SAI Global, Dec 11, 2021. [Online-pdf]. Available: https://infostore.saiglobal.com/enus/standards/din-en-1990-2010-386091_saig_din_din_877194/ [Accessed: Dec. 11, 2021].
• [19] “ASTM Standards”, https://www.astm.org, Standards Online, Dec 11, 2021. [Online-pdf]. Available: https://www.astm.org/Standards/B298.htm [Accessed: Dec. 11, 2021].
• [20] “ISO Standards”, https://www.iso.org, TS EN ISO 4524, Dec 11, 2021. [Online-pdf]. Available: https://intweb.tse.org.tr [Accessed: Dec. 11, 2021].
• [21] B. Jiang, J. Fu, D. Li and L. Ke, “An Advanced Structural Analysis Method for Connector Terminal Based on Multi-step Forming”, In Proceedings of SAE-China Congress 2015: Selected Papers, 2015, pp. 599-608, doi: 10.1007/978-981-287-978-3_54.