Research Article
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Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant

Year 2026, Volume: 29 Issue: 1 , 17 - 24 , 08.03.2026
https://doi.org/10.5541/ijot.1615158
https://izlik.org/JA86KP72TB

Abstract

The environmental concerns around synthetic refrigerants have prompted the investigation of novel and environmentally friendly cooling systems. With an emphasis on its distinct thermodynamic characteristics and refrigeration cycle performance, this study investigates the viability of employing electrons as a refrigerant. Critical processes were theoretically modelled, including expansion, constant-pressure heating, and adiabatic compression. Combining theoretical understanding with empirical support, the study lays the groundwork for further investigation and improvement and provides a fundamental understanding of electron gas as a refrigerant. A specially designed experimental setup was created to validate these models, allowing for accurate monitoring of temperature variations, heat transfer effectiveness, and overall system performance. Compared to traditional refrigeration techniques, the experimental findings showed a better Coefficient of Performance (COP) of 20.65, indicating higher energy efficiency. These results demonstrate the electron (electron gas)'s potential as a practical and best substitute for conventional refrigerants, tackling critical environmental issues. The result shows that this work marks a substantial leap in creating more environmentally friendly and effective refrigeration technologies. In the future, this work will be studied for both commercial and residential settings.

References

  • Mohanraj, S. Jayaraj, and C. Muraleedharan, “Environment friendly alternatives to halogenated refrigerants—A review,” International Journal of Greenhouse Gas Control, vol. 3, no. 1, pp. 108–119, Jan. 2009, doi: 10.1016/j.ijggc.2008.07.003.
  • I. Sarbu and C. Sebarchievici, “General review of solar-powered closed sorption refrigeration systems,” Energy Conversion and Management, vol. 105, pp. 403–422, Nov. 2015, doi: 10.1016/j.enconman.2015.07.084.
  • L. Mañosa, A. Planes, and M. Acet, “Advanced materials for solid-state refrigeration,” J. Mater. Chem. A, vol. 1, no. 16, p. 4925, 2013, doi: 10.1039/c3ta01289a.
  • Z. Zhang, X. Feng, D. Tian, J. Yang, and L. Chang, “Progress in ejector-expansion vapor compression refrigeration and heat pump systems,” Energy Conversion and Management, vol. 207, Mar. 2020, Art. no. 112529, doi: 10.1016/j.enconman.2020.112529.
  • F. Giazotto, T. T. Heikkilä, A. Luukanen, A. M. Savin, and J. P. Pekola, “Opportunities for mesoscopics in thermometry and refrigeration: Physics and applications,” Rev. Mod. Phys., vol. 78, no. 1, pp. 217–274, Mar. 2006, doi: 10.1103/RevModPhys.78.217.
  • J. R. Prance et al., “Electronic Refrigeration of a Two-Dimensional Electron Gas,” Phys. Rev. Lett., vol. 102, no. 14, Apr. 2009, Art. no. 146602, doi: 10.1103/PhysRevLett.102.146602.
  • D. Wang, K. Pan, Y. Liu, L. Wang, and Z. Liu, “Research on the cooling performance of the discontinuous transpiration surface structure for the leading edge of a hypersonic vehicle,” Applied Thermal Engineering, vol. 241, Mar. 2024, Art. no. 122324, doi: 10.1016/j.applthermaleng.2023.122324.
  • Q. Mi, S. H. Yi, D. D. Gang, X. G. Lu, and X. L. Liu, “Research progress of transpiration cooling for aircraft thermal protection,” Applied Thermal Engineering, vol. 236, Jan. 2024, Art. no. 121360, doi: 10.1016/j.applthermaleng.2023.121360.
  • O. L. Paxton, H. Porat, and I. H. Jahn, “Experimental results of the electron transpiration cooling effect in the x2 expansion tunnel,” in AIAA AVIATION 2023 Forum, San Diego, CA and Online: American Institute of Aeronautics and Astronautics, June 2023. doi: 10.2514/6.2023-3808.
  • L. Cong, R. Li, X. Luo, L. Ma, and J. He, “Performance characteristics and optimal analysis of an energy selective electron refrigerator,” Int. J. Thermo, vol. 17, no. 3, p. 171, Sept. 2014, doi: 10.5541/ijot.558.
  • H. Tan and A. Eri̇Şen, “Novel design and thermodynamic analyses of cascade refrigeration system at ultra-low temperature,” International Journal of Thermodynamics, vol. 25, no. 1, pp. 142–150, Mar. 2022, doi: 10.5541/ijot.1017282.
  • P. Mariselvam, T. Velmurugan, and G. Karthikeyan, “Prediction of thermal properties of r-glass/epoxy laminates for temperature variation,” Revista Romana de Materiale/ Romanian Journal of Materials, vol. 53, no. 4, pp. 288–296, 2023, [Online]. Available: https://solacolu.chim.upb.ro/pg288-296.pdf
  • Y. Tokiwa, B. Piening, H. S. Jeevan, S. L. Bud’ko, P. C. Canfield, and P. Gegenwart, “Super-heavy electron material as metallic refrigerant for adiabatic demagnetization cooling,” Sci. Adv., vol. 2, no. 9, Sept. 2016, Art. no. e1600835, doi: 10.1126/sciadv.1600835.
  • J. M. Calm, “Emissions and environmental impacts from air-conditioning and refrigeration systems,” International Journal of Refrigeration, vol. 25, no. 3, pp. 293–305, May 2002, doi: 10.1016/S0140-7007(01)00067-6.
  • D. Astrain, J. G. Vián, and M. Domı́nguez, “Increase of COP in the thermoelectric refrigeration by the optimization of heat dissipation,” Applied Thermal Engineering, vol. 23, no. 17, pp. 2183–2200, Dec. 2003, doi: 10.1016/S1359-4311(03)00202-3.
  • F. J. DiSalvo, “Thermoelectric Cooling and Power Generation,” Science, vol. 285, no. 5428, pp. 703–706, July 1999, doi: 10.1126/science.285.5428.703.
  • L. E. Bell, “Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems,” Science, vol. 321, no. 5895, pp. 1457–1461, Sept. 2008, doi: 10.1126/science.1158899.
  • T. M. Tritt, “Thermoelectric Phenomena, Materials, and Applications,” Annu. Rev. Mater. Res., vol. 41, no. 1, pp. 433–448, Aug. 2011, doi: 10.1146/annurev-matsci-062910-100453.
  • J. He and T. M. Tritt, “Advances in thermoelectric materials research: Looking back and moving forward,” Science, vol. 357, no. 6358, Sept. 2017, doi: 10.1126/science.aak9997.
  • J. H. Davies and A. R. Long, Eds., “N1.1 Electron gas refrigeration and thermometry by semiconductor–superconductor junctions,” in Physics of Semiconductors 2002, 0 ed., CRC Press, 2003, pp. 285–292. doi: 10.1201/9781482269055-37.
  • Y.-G. Lv, Y.-T. Wang, T. Meng, Q.-W. Wang, and W.-X. Chu, “Review on thermal management technologies for electronics in spacecraft environment,” Energy Storage and Saving, vol. 3, no. 3, pp. 153–189, Sept. 2024, doi: 10.1016/j.enss.2024.03.001.
  • T. O. Oni, S. J. Aliyu, B. A. Adaramola, and O. L. Rominiyi, “A Semiconductor-Based Refrigeration System for Cooling of Water: Design, Construction, and Performance Tests,” PEET, vol. 2, no. 1, pp. 15–25, Mar. 2023, doi: 10.56578/peet020102.
  • P. Vijayapakavan, D. S. Robinson Smart, K. Ramu, and M. Ramachandran, “Superconducting Electromagnetic Launch Machine System for Aerospace Applications,” jacp, vol. 2, no. 1, pp. 40–47, June 2023, doi: 10.46632/jacp/2/1/5.
  • A. R. Dhumal, A. P. Kulkarni, and N. H. Ambhore, “A comprehensive review on thermal management of electronic devices,” J. Eng. Appl. Sci., vol. 70, no. 1, Dec. 2023, Art. no. 140, doi: 10.1186/s44147-023-00309-2.
  • D. Thesiya, H. Patel, and G. S. Patange, “A comprehensive review electronic cooling: A nanomaterial perspective,” International Journal of Thermofluids, vol. 19, Aug. 2023, Art. no. 100382, doi: 10.1016/j.ijft.2023.100382.
  • A. S. Kurhade et al., “A Comprehensive Review of Electronic Cooling Technologies in Harsh Field Environments: Obstacles, Progress, and Prospects,” jmmf, pp. 557–579, Sept. 2024, doi: 10.18311/jmmf/2024/45212.
  • Q. Mi, S. H. Yi, D. D. Gang, X. G. Lu, and X. L. Liu, “Research progress of transpiration cooling for aircraft thermal protection,” Applied Thermal Engineering, vol. 236, Jan. 2024, Art. no. 121360, doi: 10.1016/j.applthermaleng.2023.121360.
  • S. H. Siddiqui and A. Langde, “Performance analysis in the design of thermoacoustic refrigeration system: review,” Energy Sources, Part A: Recovery, Utilization, and Environmental Effects, vol. 45, no. 3, pp. 7705–7731, Aug. 2023, doi: 10.1080/15567036.2023.2223148.
  • M. D. Ulrich, P. A. Barnes, and C. B. Vining, “Comparison of solid-state thermionic refrigeration with thermoelectric refrigeration,” Journal of Applied Physics, vol. 90, no. 3, pp. 1625–1631, Aug. 2001, doi: 10.1063/1.1380996.
  • B. Jug and Z. Trontelj, “An improvement in model for electronic gas refrigerator,” Physica B: Condensed Matter, vol. 284–288, pp. 2034–2035, July 2000, doi: 10.1016/S0921-4526(99)02825-2.

Year 2026, Volume: 29 Issue: 1 , 17 - 24 , 08.03.2026
https://doi.org/10.5541/ijot.1615158
https://izlik.org/JA86KP72TB

Abstract

References

  • Mohanraj, S. Jayaraj, and C. Muraleedharan, “Environment friendly alternatives to halogenated refrigerants—A review,” International Journal of Greenhouse Gas Control, vol. 3, no. 1, pp. 108–119, Jan. 2009, doi: 10.1016/j.ijggc.2008.07.003.
  • I. Sarbu and C. Sebarchievici, “General review of solar-powered closed sorption refrigeration systems,” Energy Conversion and Management, vol. 105, pp. 403–422, Nov. 2015, doi: 10.1016/j.enconman.2015.07.084.
  • L. Mañosa, A. Planes, and M. Acet, “Advanced materials for solid-state refrigeration,” J. Mater. Chem. A, vol. 1, no. 16, p. 4925, 2013, doi: 10.1039/c3ta01289a.
  • Z. Zhang, X. Feng, D. Tian, J. Yang, and L. Chang, “Progress in ejector-expansion vapor compression refrigeration and heat pump systems,” Energy Conversion and Management, vol. 207, Mar. 2020, Art. no. 112529, doi: 10.1016/j.enconman.2020.112529.
  • F. Giazotto, T. T. Heikkilä, A. Luukanen, A. M. Savin, and J. P. Pekola, “Opportunities for mesoscopics in thermometry and refrigeration: Physics and applications,” Rev. Mod. Phys., vol. 78, no. 1, pp. 217–274, Mar. 2006, doi: 10.1103/RevModPhys.78.217.
  • J. R. Prance et al., “Electronic Refrigeration of a Two-Dimensional Electron Gas,” Phys. Rev. Lett., vol. 102, no. 14, Apr. 2009, Art. no. 146602, doi: 10.1103/PhysRevLett.102.146602.
  • D. Wang, K. Pan, Y. Liu, L. Wang, and Z. Liu, “Research on the cooling performance of the discontinuous transpiration surface structure for the leading edge of a hypersonic vehicle,” Applied Thermal Engineering, vol. 241, Mar. 2024, Art. no. 122324, doi: 10.1016/j.applthermaleng.2023.122324.
  • Q. Mi, S. H. Yi, D. D. Gang, X. G. Lu, and X. L. Liu, “Research progress of transpiration cooling for aircraft thermal protection,” Applied Thermal Engineering, vol. 236, Jan. 2024, Art. no. 121360, doi: 10.1016/j.applthermaleng.2023.121360.
  • O. L. Paxton, H. Porat, and I. H. Jahn, “Experimental results of the electron transpiration cooling effect in the x2 expansion tunnel,” in AIAA AVIATION 2023 Forum, San Diego, CA and Online: American Institute of Aeronautics and Astronautics, June 2023. doi: 10.2514/6.2023-3808.
  • L. Cong, R. Li, X. Luo, L. Ma, and J. He, “Performance characteristics and optimal analysis of an energy selective electron refrigerator,” Int. J. Thermo, vol. 17, no. 3, p. 171, Sept. 2014, doi: 10.5541/ijot.558.
  • H. Tan and A. Eri̇Şen, “Novel design and thermodynamic analyses of cascade refrigeration system at ultra-low temperature,” International Journal of Thermodynamics, vol. 25, no. 1, pp. 142–150, Mar. 2022, doi: 10.5541/ijot.1017282.
  • P. Mariselvam, T. Velmurugan, and G. Karthikeyan, “Prediction of thermal properties of r-glass/epoxy laminates for temperature variation,” Revista Romana de Materiale/ Romanian Journal of Materials, vol. 53, no. 4, pp. 288–296, 2023, [Online]. Available: https://solacolu.chim.upb.ro/pg288-296.pdf
  • Y. Tokiwa, B. Piening, H. S. Jeevan, S. L. Bud’ko, P. C. Canfield, and P. Gegenwart, “Super-heavy electron material as metallic refrigerant for adiabatic demagnetization cooling,” Sci. Adv., vol. 2, no. 9, Sept. 2016, Art. no. e1600835, doi: 10.1126/sciadv.1600835.
  • J. M. Calm, “Emissions and environmental impacts from air-conditioning and refrigeration systems,” International Journal of Refrigeration, vol. 25, no. 3, pp. 293–305, May 2002, doi: 10.1016/S0140-7007(01)00067-6.
  • D. Astrain, J. G. Vián, and M. Domı́nguez, “Increase of COP in the thermoelectric refrigeration by the optimization of heat dissipation,” Applied Thermal Engineering, vol. 23, no. 17, pp. 2183–2200, Dec. 2003, doi: 10.1016/S1359-4311(03)00202-3.
  • F. J. DiSalvo, “Thermoelectric Cooling and Power Generation,” Science, vol. 285, no. 5428, pp. 703–706, July 1999, doi: 10.1126/science.285.5428.703.
  • L. E. Bell, “Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems,” Science, vol. 321, no. 5895, pp. 1457–1461, Sept. 2008, doi: 10.1126/science.1158899.
  • T. M. Tritt, “Thermoelectric Phenomena, Materials, and Applications,” Annu. Rev. Mater. Res., vol. 41, no. 1, pp. 433–448, Aug. 2011, doi: 10.1146/annurev-matsci-062910-100453.
  • J. He and T. M. Tritt, “Advances in thermoelectric materials research: Looking back and moving forward,” Science, vol. 357, no. 6358, Sept. 2017, doi: 10.1126/science.aak9997.
  • J. H. Davies and A. R. Long, Eds., “N1.1 Electron gas refrigeration and thermometry by semiconductor–superconductor junctions,” in Physics of Semiconductors 2002, 0 ed., CRC Press, 2003, pp. 285–292. doi: 10.1201/9781482269055-37.
  • Y.-G. Lv, Y.-T. Wang, T. Meng, Q.-W. Wang, and W.-X. Chu, “Review on thermal management technologies for electronics in spacecraft environment,” Energy Storage and Saving, vol. 3, no. 3, pp. 153–189, Sept. 2024, doi: 10.1016/j.enss.2024.03.001.
  • T. O. Oni, S. J. Aliyu, B. A. Adaramola, and O. L. Rominiyi, “A Semiconductor-Based Refrigeration System for Cooling of Water: Design, Construction, and Performance Tests,” PEET, vol. 2, no. 1, pp. 15–25, Mar. 2023, doi: 10.56578/peet020102.
  • P. Vijayapakavan, D. S. Robinson Smart, K. Ramu, and M. Ramachandran, “Superconducting Electromagnetic Launch Machine System for Aerospace Applications,” jacp, vol. 2, no. 1, pp. 40–47, June 2023, doi: 10.46632/jacp/2/1/5.
  • A. R. Dhumal, A. P. Kulkarni, and N. H. Ambhore, “A comprehensive review on thermal management of electronic devices,” J. Eng. Appl. Sci., vol. 70, no. 1, Dec. 2023, Art. no. 140, doi: 10.1186/s44147-023-00309-2.
  • D. Thesiya, H. Patel, and G. S. Patange, “A comprehensive review electronic cooling: A nanomaterial perspective,” International Journal of Thermofluids, vol. 19, Aug. 2023, Art. no. 100382, doi: 10.1016/j.ijft.2023.100382.
  • A. S. Kurhade et al., “A Comprehensive Review of Electronic Cooling Technologies in Harsh Field Environments: Obstacles, Progress, and Prospects,” jmmf, pp. 557–579, Sept. 2024, doi: 10.18311/jmmf/2024/45212.
  • Q. Mi, S. H. Yi, D. D. Gang, X. G. Lu, and X. L. Liu, “Research progress of transpiration cooling for aircraft thermal protection,” Applied Thermal Engineering, vol. 236, Jan. 2024, Art. no. 121360, doi: 10.1016/j.applthermaleng.2023.121360.
  • S. H. Siddiqui and A. Langde, “Performance analysis in the design of thermoacoustic refrigeration system: review,” Energy Sources, Part A: Recovery, Utilization, and Environmental Effects, vol. 45, no. 3, pp. 7705–7731, Aug. 2023, doi: 10.1080/15567036.2023.2223148.
  • M. D. Ulrich, P. A. Barnes, and C. B. Vining, “Comparison of solid-state thermionic refrigeration with thermoelectric refrigeration,” Journal of Applied Physics, vol. 90, no. 3, pp. 1625–1631, Aug. 2001, doi: 10.1063/1.1380996.
  • B. Jug and Z. Trontelj, “An improvement in model for electronic gas refrigerator,” Physica B: Condensed Matter, vol. 284–288, pp. 2034–2035, July 2000, doi: 10.1016/S0921-4526(99)02825-2.
There are 30 citations in total.

Details

Primary Language English
Subjects Thermodynamics and Statistical Physics
Journal Section Research Article
Authors

Velmurugan T This is me 0009-0009-6822-3722

Mariselvam P 0000-0001-5456-8396

Saraswathi A This is me 0000-0003-1070-3837

Mala D This is me 0000-0001-9800-0997

Submission Date January 7, 2025
Acceptance Date December 9, 2025
Publication Date March 8, 2026
DOI https://doi.org/10.5541/ijot.1615158
IZ https://izlik.org/JA86KP72TB
Published in Issue Year 2026 Volume: 29 Issue: 1

Cite

APA T, V., P, M., A, S., & D, M. (2026). Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant. International Journal of Thermodynamics, 29(1), 17-24. https://doi.org/10.5541/ijot.1615158
AMA 1.T V, P M, A S, D M. Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant. International Journal of Thermodynamics. 2026;29(1):17-24. doi:10.5541/ijot.1615158
Chicago T, Velmurugan, Mariselvam P, Saraswathi A, and Mala D. 2026. “Theoretical Derivation and Feasibility Analysis of Electron Flow As a Novel Refrigerant”. International Journal of Thermodynamics 29 (1): 17-24. https://doi.org/10.5541/ijot.1615158.
EndNote T V, P M, A S, D M (March 1, 2026) Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant. International Journal of Thermodynamics 29 1 17–24.
IEEE [1]V. T, M. P, S. A, and M. D, “Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant”, International Journal of Thermodynamics, vol. 29, no. 1, pp. 17–24, Mar. 2026, doi: 10.5541/ijot.1615158.
ISNAD T, Velmurugan - P, Mariselvam - A, Saraswathi - D, Mala. “Theoretical Derivation and Feasibility Analysis of Electron Flow As a Novel Refrigerant”. International Journal of Thermodynamics 29/1 (March 1, 2026): 17-24. https://doi.org/10.5541/ijot.1615158.
JAMA 1.T V, P M, A S, D M. Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant. International Journal of Thermodynamics. 2026;29:17–24.
MLA T, Velmurugan, et al. “Theoretical Derivation and Feasibility Analysis of Electron Flow As a Novel Refrigerant”. International Journal of Thermodynamics, vol. 29, no. 1, Mar. 2026, pp. 17-24, doi:10.5541/ijot.1615158.
Vancouver 1.Velmurugan T, Mariselvam P, Saraswathi A, Mala D. Theoretical Derivation and Feasibility Analysis of Electron Flow as a Novel Refrigerant. International Journal of Thermodynamics. 2026 Mar. 1;29(1):17-24. doi:10.5541/ijot.1615158