Comparison of the Effect of Adhesive Protocols and Light Curing Units on the Repair Bond Strength of Bulk Fill Composite Resins

Yıl 2024, Cilt: 11 Sayı: 3, 299 - 302, 23.12.2024

Kübra Bilge , İrem İpek , Enes Mustafa Aşar

https://doi.org/10.15311/selcukdentj.1512564

Öz

Background: The aim of this study is to compare the shear bond strength (SBS) after the repair of a microhybrid composite resin (CR) with three different bulk fill CRs using a 2nd and 3rd generation light-emitting diode (LED) light curing units and a universal adhesive with different application protocols.
Methods: 120 acrylic blocks, each with an open surface and a depth of 2 mm and a diameter of 6 mm, were filled with a microhybrid CR (Filtek Z250) and cured with an LED for 20 seconds. The samples were roughened for 5 seconds with a diamond fissure bur under water cooling and then subjected to 5,000 thermal cycles. A universal adhesive was applied to the prepared samples using two different protocols (total etch and self-etch), and samples were then filled with bulk fill CRs. Each bulk fill CR group was polymerized with 2nd and 3rd generation LED to form subgroups (n=10). The SBS values were recorded in MPa using a universal testing device.
Results: The highest SBS values were obtained for the X-tra Fil group in total etch mode with polymerization using 3rd generation LED, while the lowest SBS values were found for Filtek One Bulk Fill group in self-etch mode with polymerization using the 3rd generation LED. In all groups, total etch mode yielded higher SBS values compared to self-etch mode.
Conclusion: Different adhesive protocols and LCUs were found to affect the SBS values of bulk fill CRs during repair.

Anahtar Kelimeler

Adhesive Protocols, Bulk Fill Composite, Composite Repair, LED Units

Adeziv Protokollerinin ve Işıkla Sertleştirme Ünitelerinin Bulk Fill Kompozit Rezinlerin Tamir Bağlanma Dayanımı Üzerindeki Etkisinin Karşılaştırılması

Öz

Amaç: Bu çalışmanın amacı 2. ve 3. nesil LED ışık cihazının ve universal bir adezivin farklı uygulama protokolüyle kullanılmasının mikrohibrit bir kompozit rezinin (KR) 3 farklı bulk fill KR ile tamiri sonrası makaslama bağlanma dayanımlarını (SBS) kıyaslamaktır.
Materyal Metod: Bir yüzeyi açık ve derinliği 2 mm, çapı 6 mm olan 120 adet akrilik blok bir mikrohibrit KR olan Filtek Z250 ile dolduruldu ve LED ışık cihazı ile 20 sn ışıklandı. Hazırlanan örnekler su soğutması altında elmas fissür frez ile 5 saniye pürüzlendirildi ve 5.000 termal döngüye tabi tutuldu. Hazırlanan örneklere universal bir adeziv ajan iki farklı protokolle (total etch ve self etch) uygulandı ve gruplara uygun olacak şekilde bulk fill KR’ lerle dolduruldu. Alt grupları oluşturmak için ise her bir bulk fill KR grubu 2. ve 3. nesil LED ışık cihazları ile polimerize edildi (n=10). Örnekler universal bir test cihazında SBS testine tabi tutularak değerler MPa cinsinden kaydedildi.
Bulgular: X-tra Fil KR grubunun total etch modunda 3. nesil LED ışık cihazıyla polimerizasyonu sonrası en yüksek, Filtek One Bulk Fill KR grubunun self etch modunda 3. nesil LED ışık cihazıyla polimeriasyonu sonrası ise en düşük SBS değerleri elde edilmiştir. Bütün gruplarda total etch modunda self etch moduna kıyasla daha yüksek SBS değerleri gözlendi.
Sonuç: Farklı adeziv protokoller ve ışık cihazları bulk fill KR’ lerin tamirinde SBS değerleri üzerinde etkili bulunmuştur.

Anahtar Kelimeler

Adeziv Protokol, Bulk Fill Kompozitler, Kompozit Tamiri, LED Işık Cihazı

Kaynakça

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