Thermal Residual Stresses Analyses of Two-Dimensional Functionally Graded Circular Plates with Temperature-Dependent Material Properties

Yıl 2018, Cilt: 10 Sayı: 2, 202 - 213, 29.06.2018

Munise Didem Demirbaş Mustafa Kemal Apalak

https://doi.org/10.29137/umagd.444080

Cited By: 1

Öz

In this study, thermal residual stress analysis
of Functionally Graded Circular Plates joined with adhesive (FGCP-A) is
presented. Finite difference equations are used in solving Navier’s equations of elasticity and heat transfer. The
grading along the plate is made along the surface of the plate. Material properties of the plate are
investigated depending on the temperature dependent/independent and it is
assumed that the temperature independent material properties changed according
to the Mori-Tanaka approach. Grading along the plate is made in both radial and
angular directions.  In this study, the effects of temperature dependent/independent material
properties and compositional gradient exponents on temperature, equivalent
strain and equivalent stress are compared.  As a result, when considering the properties
of the material depending on the temperature, the temperature, equivalent
stress and strain distributions and levels vary considerably. Therefore, the
properties of the material dependent on the temperature must be taken into
consideration in the analysis of thermal residual stress of materials used as
high temperature material.

Anahtar Kelimeler

Functionally graded circular plates, Finite difference methods, Thermal residual stress, adhesive, temperature-dependent material properties

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