EFFECT OF CURING UNITS AND ADHESION STRATEGIES ON MICROLEAKAGE OF BULK-FILL COMPOSITES: AN IN VITRO STUDY

Year 2019, Volume: 29 Issue: 1, 74 - 79, 15.01.2019

Betul Memiş Özgül G. Burcu Bostancı R. Ebru Tirali Sevi Burcak Çehreli

https://doi.org/10.17567/ataunidfd.522743

Cited By: 1

Abstract

ABSTRACT

 

Aim: This
study was performed to investigate the effects of different light-curing units
on microleakage of bulk-fill composites applied using different adhesion
strategies (self-etch or selective etch).

Material
and Methods: Twenty-six extracted third molar teeth were randomly
divided into 2 groups (n=13) according to the light-curing units used: either a
quartz tungsten halogen lamp or light-emitting diode lamp. Two standardized
occlusal cavities (2×3×3 mm) were prepared on each tooth to create subgroups
(self-etch or selective etch). Cavities in the elective etch subgroup were
etched prior to restoration procedures using 37% orthophosphoric acid. All
cavities were then restored with a nano-filler bulk-fill composite resin using
Universal Bond (All-Bond Universal; Bisco, Schaumburg, IL, USA) as an adhesive.
The light activations were performed according to the light-curing units. Teeth
were thermocycled 2500 times at 5°C–55°C, then immersed in 0.5% basic fuchsin
solution for 24 hours. Microleakage was quantitatively assessed using the
dye-penetration method along with quantitative computer-aided image
measurement. Data analysis was performed using the Mann–Whitney U test.

Results: The
selective etch group had significantly lower microleakage measurements than the
Universal Bond group (p<0.05) in both the quartz tungsten halogen lamp and
light-emitting diode lamp curing groups. However, there was no significant
difference between the self etch and selective etch subgroups according to the
light-curing units used (p>0.05).

Conclusions: The
selective etch method provides better adhesion when bulk-fill composites are
used regardless of the light-curing units being used. 

Keywords: Bulk-fill composites, LED, self-etch technique, selective etch
technique, QTH

IŞIK CIHAZLARI VE ADHEZYON STARTEJILERININ KÜTLESEL
IŞIKLANABILEN KOMPOZITLERIN MIKROSIZINTILARI ÜZERINE ETKILERI: IN-VITRO ÇALIŞMA

ÖZ

Amaç: Bu çalışma, farklı
ışık-polimerizasyon ünitelerinin farklı adhezyon stratejileri (self-etch veya
selektif etch) kullanılarak uygulanan kütlesel ışıklanabilen kompozitlerin
mikrosızıntısı üzerindeki etkilerini araştırmak amacıyla yapılmıştır.

Gereç ve
Yöntem: 26 adet çekilmiş üçüncü molar diş,
kullanılan ışık-polimerizasyon ünitelerine göre quartz tungsten halojen (QTH)
veya ışık yayan diyot (LED) olmak üzere 2 gruba (n=13) ayrıldı.  Alt grupları oluşturmak amacıyla (self-etch(SE)
veya selektif etch (SLE)) her diş üzerinde iki standart okluzal kavite (2 ×3 ×3
mm) hazır- landı. SLE alt grubundaki kaviteler, %37'lik ortofosforik asit
kullanılarak restorasyon prosedürlerinden önce hazırlandı. Tüm kaviteler daha
sonra Universal Bond (All-Bond Universal; Bisco, Schaumburg, IL, ABD) bağlayıcı
ajan kullanılarak bir nano dolduruculu kütlesel ışıklana- bilen kompozit
rezinle restore edildi. Işık aktivasyonları ait oldukları grubun
ışık-polimerizasyon ünitelerine göre ya- pıldı. Dişler, 5 °C-55 °C' de 2500 kez
termal döngüye ta- bi tutuldu daha sonra 24 saat boyunca %0.5 bazik fuksin
çözeltisinde bekletildi. Mikrosızıntı, boya-penetrasyon yöntemi kullanılarak,
bilgisayar destekli görüntü ölçümü ile kantitatif olarak değerlendirildi. Veri
analizi Mann-Whitney U testi kullanılarak yapıldı.

Bulgular:
Selektif etch (SLE) grubu için hem quartz tungsten halojen hem de ışık yayan diyot gruplarında Universal Bond
grubuna göre (p <0.05) anlamlı derecede düşük mikro-sızıntı ölçümleri
bulgulandı. Bununla birlikte kullanılan ışık-polimerizasyon ünitesine göre
self-etch ve selektif etch alt grupları arasında anlamlı fark görülmedi (p>
0.05).

Sonuç: SLE yöntemi,
kullanılan ışık cihazından bağımsız olarak kütlesel olarak ışıklanabilen
kompozitler kullanıldı- ğında daha iyi bir adezyon sağlamıştır.

Anahtar
Kelimeler:
Bulk-fill kompozitler, LED, self- etch tekniği, selektif etch tekniği, QTH

Keywords

Bulk-fill composites, LED, self-etch technique, selective etch technique

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