ÇEVRE DOSTU KİMYASALLAR KULLANILARAK ABS PLASTİK ÜZERİNE AKIMSIZ BAKIR KAPLANMASI

Abstract

In this study, the electroless copper plating technique was applied on Acrylonitrile Butadiene Styrene (ABS) plastic. The effects of ionic liquid types, plating time and sanding paper size were investigated on plating. Experiments were carried out with two different types of ionic liquids: 1-ethyl-3-methyl imidazolium chloride (EMIC C6H11NCl) and 1-ethyl 3-methylimidazolium dicyanamide (DCA, C8H11N5), with 120-500 grit sandpapers by applying sand attrition process, at constant bath temperature as 60⁰C, and with 30-150 minutes of deposition times. The characterization of the coated samples was performed by X-ray Diffraction (XRD) and Scanning Electron Microscopy (SEM). Experimental results show that the copper plating on ABS plastic was succeeded. The maximum amount of deposit was obtained by using EMIC as catalyst with 150 min deposition time and with 500 grit sandpaper size

Keywords

• EMIC, DCA, ABS, Metal plating, Electroless plating

ELECTROLESS CU PLATING ON ABS PLASTIC BY USING ENVIRONMENTALLY FRIENDLY CHEMICALS

Abstract

Bu çalışmada Akrilonitril Bütadien Stiren (ABS) plastiği üzerine akımsız bakır kaplama tekniği uygulanmıştır. İyonik sıvı çeşidinin, kaplama sıcaklığının, kaplama süresi ve zımpara kağıt boyutunun kaplama üzerine etkileri araştırılmıştır. Deneyler, 1etil-3-metil imidazolyum klorür (EMIC) ve 1-etil-3-metilimidazolyum dikyanamit (DCA) olmak üzere iki çeşit iyonik çözelti kullanılarak, 120-500 kum boyut aralığındaki zımpara kağıtları ile aşındırma işlemi uygulanarak, 60⁰C sabit banyo sıcaklığında, 30-150 dakika kaplama süresi ile gerçekleştirilmiştir. Kaplanan örneklerin karakterizasyonları X-ray Diffraction (XRD) ve Scanning Electron Microscopy (SEM) cihazlarıyla yapılmıştır. Deneylerden elde edilen sonuçlara göre ABS plastiği üzerine bakır kaplama tekniğinde başarılı olunmuştur. En yüksek kaplama kalınlığı, katalizör olarak EMIC iyonik sıvısı kullanılarak, 150 dak. kaplama süresinde ve 500 kum boyutundaki zımpara kağıdı ile elde edilmiştir. *Canan URAZ: [e-mail] 1. Introduction

Keywords

• EMIC, DCA, ABS, Metal kaplama, Akımsız kaplama

References

1. Tang, X., Bi, C., Han, C., Zhang, B. A New Palladium Free Surface Activation Process for Ni Electroless Plating on ABS Plastic, Materials Letters, 63, 840-842, DOI:10.1016/j.matlet.2009.01.006.
2. Ngo, H.L., LeCompte, K., Hargens, L., McEwen, A.B., 2000. Thermal properties of imidazolium ionic liquids, Thermochimica Acta, 357- , 97-102, PII: S 0040- (00)00373-7.
3. Murugesan,S. ve Linhardt, R.J., Ionic liquids in carbohydrate chemistry-current future directions, Current Organic Synthesis, 2, 437-451, DOI: 1570- /05. and Koura, N., Nagase, H., Sato, A.,
4. Kumakura, S., Takeuchi, K., Ui, K., Tsuda, T., Loong, C. K. 2008.
5. Electroless Plating of Aluminum from a Room-Temperature Ionic Liquid Electrolyte, Journal of Electrochemical Society, 155, 155- , IP 130.203.136.75. Deng Ming-Jay, I.-Wen Sun, Po-Yu Chen, Jeng-Kuei Chang,Wen-Ta Tsai, behavior of nickel in the water- and methylimidazolium-dicyanamide room-temperature ionic liquid, Electrochimica Acta, 53, 5812– ,DOI: 10.1016/j.electacta.200 03.040. ethyl-3
6. Ang, L.L., Hor, T. S. A., Xu, G. Q., Tung, C. H., Zhao, S.P., Wang, J. L.S. Decoration of Activated Carbon Nanotubes with Copper and Nickel, Carbon, 38, 363-372, DOI:10.1016 / S0008-6223 (99) 8.
7. Liu, Z., Chen, Y. 1998. Spectroscopic
8. Studies on Tetragonal ZrO2- Supported MoO3 and NiO- MoO3 Systems, Journal of Catalysis, 177, 324, DOI: 0021-9517/98.

9. Rudnik, E., Kokoszka, K., Łapsa, J. Comparative Studies on the Electroless Deposition of Ni-P, Co-P and Their Composites with SiC Particles, Surface & Coatings Technology, 202, DOI: 2584-2590, 11118/actaun201664051459.
10. Caturla, F., Molina, F., Molina-Sabio, M., Rodriguez-Reinoso, F., Esteban, A. 1995. Electroless Plating of
11. Graphite with Copper and Nickel, Journal of Electrochemical Science, , 4084-4091, ISSN 1452-3981.
12. Fukuhara, C., Ohkura, H., Gonohe, K., Igarashi, A. 2005. Low- Temperature
13. Reaction of Plate-Type Copper- Based Catalysts on an Aluminum Plate Prepared by Electroless Plating, Applied Catalysis A: General, 279, 195–203, DOI: 1016/j.apcata.2004.10.036.
14. Song, L., Li, W., Wang, G., Zhang, M., Tao, K. 2007. A New Route to Prepare
15. Phosphide/Silica-Alumina Hydrotreating Amorphous Nickel Catalysts from Alloys, Catalysis , 142, Luo, L., Lu, Z., Huang, X., Tan, X., Ding, X., Cheng, J., Zhu, L., Wu, Y. Electroless Copper Plating on PC Engineering Plastic with a Novel Activation Process, Surface & Coating Technology, 251, 69-73, DOI:10.1179/1743294414Y.00000 Surface