Çoklu Piezoelektrik Fanlarda Soğutma Parametrelerinin Parametrik İncelenmesi: Deneysel Bir Optimizasyon

Abstract

Piezoelektrik fanların kullanımı, kompakt yapı, yüksek enerji verimliliği, hafiflik, düşük gürültü ve dayanıklılık gibi avantajları nedeniyle soğutma uygulamalarında termal yönetimde giderek artan bir ilgi görmektedir. Bu bağlamda, bu çalışmada bir yüzeyde soğutma amacıyla çoklu piezoelektrik fan performansı incelenmiştir. Çalışma, çoklu fan uygulamalarında alüminyum panel soğutmasını etkileyen etkili parametreleri inceleyerek ısı transferini iyileştirme amacıyla gerçekleştirilmiştir. Araştırma, yüzey sıcaklığı, fan konumu, süre ve genlik parametrelerinin ısı transferi üzerindeki etkilerini kapsamıştır. Parametrik çalışmada, operasyonel parametrelerin plakanın soğutulması üzerindeki etkileri gözlemlenerek parametrelerin optimum değerlerini belirlemek için Yanıt Yüzeyi Yöntemi (RSM) kullanılmıştır. Bu araştırmanın sonucu, yüzey sıcaklığı için 35 °C, piezoelektrik fan konumu için yatay-yatay konum, soğutma süresi için 15 s ve piezoelektrik fan genliği için maksimum konum olan 18 mm için optimum sonuçlar vermiştir. Ayrıca, bağımsız değişkenler olarak yüzey sıcaklığı, PE fan konumu ve soğutma süresi kullanılarak, genliğin minimum ve maksimum değerlerine karşılık gelen Nusselt sayıları için matematiksel bir model önerilmiştir.

Keywords

• Piezoelektrik fan soğutma
• Çoklu fan yönlendirmesi
• Tepki Yüzeyi Optimizasyonu
• Nusselt korelasyonu

Supporting Institution

Atatürk Üniversitesi Bilimsel Araştırma Projeleri Koordinasyon Birimi

Project Number

FYL-2023-11586.

Ethical Statement

Yazar(lar) tarafından herhangi bir potansiyel çıkar çatışması bildirilmemiştir.

Thanks

Bu çalışma, Atatürk Üniversitesi Bilimsel Araştırma Projeleri Koordinasyon Birimi tarafından FYL-2023-11586 numaralı hibe kapsamında finanse edilmiştir.

Parametric Investigation Of Cooling Parameters In Multi-Piezoelectric Fans: An Experimental Optimization

Abstract

The utilization of piezoelectric fans has growing interest in thermal management for cooling applications because of having advantages such as compact structure, high energy efficiency, light weight, low noise, and durability. In this context, multiple piezoelectric fan performance was examined in this study for cooling purposes on a surface. The study was conducted with the scope of enhancing heat transfer while examining the effective parameters influencing aluminum panel cooling in multi-fan applications. The investigation encompassed the effects of surface temperature, fan position, time, and amplitude parameters on heat transfer. In the parametric study, the Response Surface Method (RSM) was used to determine the optimum values of the parameters by observing the effects of the operational parameters on the cooling of the plate. The outcome of this investigation yielded optimal results for surface temperature at 35 °C, piezoelectric fan position at the horizontal-horizontal position, cooling time at 15 s, and piezoelectric fan amplitude at maximum position at 18 mm. Furthermore, a mathematical model has been proposed for the Nusselt numbers corresponding to the minimum and maximum values of amplitude by using independent variables surface temperature, PE fan position, and cooling time.

Keywords

• Piezoelectric fan cooling
• Multiple fans orientation
• Response Surface Optimization
• Nusselt correlation

Supporting Institution

Atatürk University Coordination Unit of Scientific Research Projects

Project Number

FYL-2023-11586.

Ethical Statement

No potential competing interest was reported by the author(s).

Thanks

This study was funded by Atatürk University Coordination Unit of Scientific Research Projects under grant no FYL-2023-11586.

References

1. [1] Lin Q, Wang K, Li L, Wang Y, Ma Z and Zhang X 2021 Heat Dissipation Structure and Test System Design of a New Piezoelectric Fan. In IOP Conference Series: Earth and Environmental Science. 804(4): 042063.
2. [2] Gaikwad A, Sathe A and Sanap S 2023 A design approach for thermal enhancement in heat sinks using different types of fins: A review. Frontiers in Thermal Engineering. 2: 980985.
3. [3] Thesiya D, Patel H and Patange G S 2023 A comprehensive review electronic cooling: a nanomaterial perspective. International Journal of Thermofluids. 19: 100382.
4. [4] Ma C, Tu Y, Ren Y, Zhou S and Wang Z 2022 Review of thermal characteristics simulation analysis of electronic components. In 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) 1-5.
5. [5] Arik M, Petroski J, Bar-Cohen A and Demiroglu M 2007 Energy efficiency of low form factor cooling devices. In ASME International Mechanical Engineering Congress and Exposition. 43025:1347-1354.
6. [6] Garimella S V, Persoons T, Weibel J and Yeh L T 2013 Technological drivers in data centers and telecom systems: Multiscale thermal, electrical, and energy management. Applied energy. 107: 66-80.
7. [7] Hales A and Jiang X 2018 A review of piezoelectric fans for low energy cooling of power electronics. Applied energy. 215: 321-337.
8. [8] Ohenhen P E, Chidolue O, Umoh A A, Ngozichukwu B, Fafure A V, Ilojianya V I and Ibekwe K I 2024 Sustainable cooling solutions for electronics: A comprehensive review: Investigating the latest techniques and materials, their effectiveness in mechanical applications, and associated environmental benefits. World Journal of Advanced Research and Reviews. 21(1): 957-972.

9. [9] Marschall K and Gautschi G H 1994 In-process monitoring with piezoelectric sensors. Journal Of Materials Processing Technology. 44(3-4): 345-352.
10. [10] Maaspuro M 2016 Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs—A review. Microelectronics Reliability. 63: 342-353.
11. [11] Jingen W, Xiangyu G, Jianguo C, Chun-Ming W, Shujun Z and Shuxiang D Review of high temperature piezoelectric materials, devices, and applications. ActaPhysicaSinica. 67(20): 10-39.
12. [12] Yu Y, Simon T W, Zhang M, Yeom T, North M T and Cui T 2014 Enhancing heat transfer in air-cooled heat sinks using piezoelectrically-driven agitators and synthetic jets. International Journal of Heat and Mass Transfer. 68: 184-193.
13. [13]Tseng K H, Mochizuki M, Mashiko K, Kosakabe T, Takenaka E, Yamamoto K and Kikutake R 2010 Piezo fan for thermal management of electronics. Fujikura Technical Review. 39-43.
14. [14] Wait S M, Basak S, Garimella S V and Raman A 2007 Piezoelectric fans using higher flexural modes for electronics cooling applications. IEEE Transactions On Components And Packaging Technologies. 30(1): 119-128.
15. [15] Sheu W J, Huang R T and Wang C C 2008 Influence of bonding glues on the vibration of piezoelectric fans. Sensors and Actuators A: Physical. 148(1): 115-121.
16. [16] Açıkalın T, Garimella S V, Petroski J and Raman A 2004 Optimal design of miniature piezoelectric fans for cooling light emitting diodes. In The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems. 1: 663-671.
17. [17] Kimber M, Garimella S V and Raman A 2007 Local heat transfer coefficients induced by piezoelectrically actuated vibrating cantilevers. ASME Journal of Heat and Mass Transfer. 129(9):1168-1176.
18. [18] Açıkalın T, Sauciuc I and Garimella S V 2005 Piezoelectric Actuators for Low-Form-Factor Electronics Cooling. In International Electronic Packaging Technical Conference and Exhibition. 42002:439-443.
19. [19] Li X J, Zhang J Z and Tan X M 2017 Convective heat transfer on a flat surface induced by a vertically-oriented piezoelectric fan in the presence of cross flow. Heat and Mass Transfer. 53: 2745-2768.
20. [20] Kimber M, Suzuki K, Kitsunai N, Seki K and Garimella S V 2009 Pressure and flow rate performance of piezoelectric fans. IEEE Transactions On Components And Packaging Technologies. 32(4): 766-775.
21. [21] Açıkalın T, Raman A and Garimella S V 2003 Two-dimensional streaming flows induced by resonating, thin beams. The Journal of the Acoustical Society of America. 114(4): 1785-1795.
22. [22] Sufian S F, Abdullah M Z and Mohamed J J 2013 Effect of synchronized piezoelectric fans on microelectronic cooling performance. International Communications in Heat and Mass Transfer. 43:81-89.
23. [23] Dereshgi H A, Dal H and Al R G 2022 Piezoelectric Fans: A Narrative Review. Journal of Smart Systems Research. 3(1): 22-29.
24. [24] Abdullah M K, Abdullah M Z, Ramana M V, Khor C Y, Ahmad K A, Mujeebu M A and Ripin Z M 2009 Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling. International Communications in Heat and Mass Transfer. 36(1): 51-58.
25. [25] Liu S F, Huang R T, Sheu W J and Wang C C 2009 Heat transfer by a piezoelectric fan on a flat surface subject to the influence of horizontal/vertical arrangement. International Journal of Heat and Mass Transfer. 52(11-12): 2565-2570.
26. [26] Zhong X L, Chan K C, Fu S C, Wang L Q and Chao C Y 2022 Enhancement of piezoelectric fan cooling by geometrical arrangements. International Journal of Heat and Mass Transfer. 199: 123479.
27. [27] Choi M, Cierpka C and Kim Y H 2014 Effects of the distance between a vibrating cantilever pair. European Journal of Mechanics-B/Fluids. 43: 154-165.
28. [28] Li X, Chen W and Lu S 2021 Characterization of the thermal performance of multi piezoelectric fans for cooling a semi-cylindrical concave surface. International Journal of Mechanical Sciences. 208: 106672.
29. [29] Petroski J, Arik M and Gursoy M 2009 Optimization of piezoelectric oscillating fan-cooled heat sinks for electronics cooling. IEEE Transactions on Components and Packaging Technologies. 33(1), 25-31.
30. [30] Han C, Ma X and Xu J 2025 Innovative configurations for heat sink integrated with piezoelectric fans. International Journal of Thermal Sciences. 207: 109383.
31. [31] Sufian S F, Fairuz Z M, Zubair M, Abdullah M Z and Mohamed J J 2014 Thermal analysis of dual piezoelectric fans for cooling multi-LED packages. Microelectronics Reliability. 54(8): 1534-1543.
32. [32] Burmann P, Raman A and Garimella S V 2002 Dynamics and topology optimization of piezoelectric fans. IEEE Transactions on Components and Packaging Technologies. 25(4): 592-600.
33. [33] Gelis K and Akyurek E F 2021 Entropy generation of different panel radiator types: Design of experiments using response surface methodology (RSM) Journal of Building Engineering. 41: 102369.
34. [34] Veza I, Spraggon M, Fattah I R and Idris M 2023 Response surface methodology (RSM) for optimizing engine performance and emissions fueled with biofuel: Review of RSM for sustainability energy transition. Results in Engineering. 18: 101213.
35. [35] Gelis K, Celik A N, Ozbek K and Ozyurt O 2022 Experimental investigation into efficiency of SiO2/water-based nanofluids in photovoltaic thermal systems using response surface methodology. Solar Energy. 235: 229-241.
36. [36] Atkinson A C 2014 Optimal design. Wiley StatsRef: Statistics Reference Online. 1-17.
37. [37] Cengel Y A and Ghajar A J 2014 Heat and Mass Transfer, Mc Graw Hill Education.
38. [38] Kline S J 1963 Describing uncertainties in single-sample experiments. Mech. Eng., 75: 3-8.